LIVE · MON, JUN 29, 2026 --:--:-- ET
Issue Nº 69 COST TOTAL $14603.40 ARTICLES TODAY 1 TOKENS TOTAL 9.23B
aiexpert
Running the wire
Funding Baidu's Kunlunxin targets $50B Hong Kong IPO, ties chip purchases to allocations Funding Momenta launches Hong Kong IPO targeting $751M for autonomous driving R&D Chips HBM now comprises 35-47% of AI accelerator BOM; GB200 HBM alone costs $4,800/unit Market Samsung HBM4 revenue tops $1 billion; targets $10 billion run-rate by end-2026 Chips OpenAI, Broadcom unveil Jalapeño LLM inference chip; gigawatt-scale deployment targeted by end-2026 Market TSMC warns AI chip shortage to persist into 2027; signals 15% 3nm price increase H2 2026 Research DeepSeek V4 DSpark speculative decoding cuts inference latency 85%, hits Together AI Breaking OpenAI launches $150M Partner Network to certify 300K consultants by year-end Breaking HP becomes flagship Frontier adopter; OpenAI scales enterprise AI agent platform with consulting partnerships Breaking Apple lobbies White House for CXMT DRAM approval as memory costs hit 20% MacBook, iPad price hikes Funding Samsung, SK Hynix plan $1.3T capex over decade on AI memory demand Breaking Lenovo, NVIDIA Partner on AI Cloud Gigafactory; Reduce Inference Server Deployment Timelines from Months to Weeks Chips Google TPUs Power Anthropic Expansion; Up to 1M Ironwood Chips Lock $40B Multi-Gigawatt Capacity Deal Through 2027+ Chips NVIDIA confirms Vera Rubin full production; Rubin GPU leads AgentPerf with 20x efficiency over Hopper Policy FERC orders grid operators to fast-track AI data center connections; 60-day deadline to justify or rewrite tariffs Chips Coherent CHIPS grant $50M for indium phosphide fab expansion; quadruples Sherman wafer output for AI optical networking Chips NVIDIA partners with SK Hynix on next-gen AI memory; codeveloping for Vera Rubin and autonomous fabs Chips TSMC CoWoS hits 98% yield; SoW-X roadmap supports 64 HBM stacks; co-packaged optics production 2026 Chips PNY DDR5-5600 32GB hits $379.99 — cheapest 2x16GB kit amid RAM crisis; 16% discount Chips TSMC 2nm mass production hits 70% yield; Apple, NVIDIA locked in through 2026 Funding Baidu's Kunlunxin targets $50B Hong Kong IPO, ties chip purchases to allocations Funding Momenta launches Hong Kong IPO targeting $751M for autonomous driving R&D Chips HBM now comprises 35-47% of AI accelerator BOM; GB200 HBM alone costs $4,800/unit Market Samsung HBM4 revenue tops $1 billion; targets $10 billion run-rate by end-2026 Chips OpenAI, Broadcom unveil Jalapeño LLM inference chip; gigawatt-scale deployment targeted by end-2026 Market TSMC warns AI chip shortage to persist into 2027; signals 15% 3nm price increase H2 2026 Research DeepSeek V4 DSpark speculative decoding cuts inference latency 85%, hits Together AI Breaking OpenAI launches $150M Partner Network to certify 300K consultants by year-end Breaking HP becomes flagship Frontier adopter; OpenAI scales enterprise AI agent platform with consulting partnerships Breaking Apple lobbies White House for CXMT DRAM approval as memory costs hit 20% MacBook, iPad price hikes Funding Samsung, SK Hynix plan $1.3T capex over decade on AI memory demand Breaking Lenovo, NVIDIA Partner on AI Cloud Gigafactory; Reduce Inference Server Deployment Timelines from Months to Weeks Chips Google TPUs Power Anthropic Expansion; Up to 1M Ironwood Chips Lock $40B Multi-Gigawatt Capacity Deal Through 2027+ Chips NVIDIA confirms Vera Rubin full production; Rubin GPU leads AgentPerf with 20x efficiency over Hopper Policy FERC orders grid operators to fast-track AI data center connections; 60-day deadline to justify or rewrite tariffs Chips Coherent CHIPS grant $50M for indium phosphide fab expansion; quadruples Sherman wafer output for AI optical networking Chips NVIDIA partners with SK Hynix on next-gen AI memory; codeveloping for Vera Rubin and autonomous fabs Chips TSMC CoWoS hits 98% yield; SoW-X roadmap supports 64 HBM stacks; co-packaged optics production 2026 Chips PNY DDR5-5600 32GB hits $379.99 — cheapest 2x16GB kit amid RAM crisis; 16% discount Chips TSMC 2nm mass production hits 70% yield; Apple, NVIDIA locked in through 2026
Funding

Anthropic scales to 1M+ Google TPUs, adds 3.5GW via Broadcom partnership; revenue run rate hits $30B

Anthropic announced a landmark expansion of its Google Cloud TPU footprint, securing access to up to one million TPU chips with well over a gigawatt of capacity coming online in 2026, plus an additional 3.5 gigawatts via a tripartite agreement with Google and Broadcom set to launch in 2027. The combined TPU expansion represents a 4.5x increase in Anthropic's compute base within 18 months. The investment is structured as a multi-year commitment worth tens of billions of dollars, with Google Cloud CEO Thomas Kurian highlighting TPU price-performance and efficiency as the deciding factors for Anthropic's selection over alternatives.

Anthropic's compute strategy is explicitly multi-cloud: the company trains Claude across Google's TPUs, Amazon's custom Trainium 2 chips (via Project Rainier), and NVIDIA GPUs, allowing it to match workloads to the chip best suited for each task. This diversified approach reduces vendor lock-in and stretches every dollar of compute further than single-vendor architectures. The company also continues its primary partnership with Amazon Web Services, which remains its chief cloud provider and training infrastructure partner. Anthropic's annual revenue run rate has surpassed $30 billion, up from approximately $9 billion at the end of 2025—a tripling in roughly 12 months.

For the AI infrastructure space, Anthropic's TPU expansion signals that custom ASICs have crossed a durability threshold: frontier labs can now justify multi-gigawatt commitments to NVIDIA alternatives. The Broadcom-Google partnership supplies the custom silicon backbone for this expansion, locking in billions in revenue for Broadcom across multiple generations through 2031. For architects, the message is clear: GPU capacity is no longer the only game in town. Multi-cloud, multi-chip strategies are becoming standard practice for scaling frontier models.

Sources