Apple commits $30B to Broadcom for 15 billion U.S.-made chips through 2031, Fort Collins expansion

Apple announced a multiyear chip supply agreement with Broadcom exceeding $30 billion, the single largest commitment under Apple's American Manufacturing Program (AMP). The deal covers the production of more than 15 billion U.S.-made chips—including custom ASIC silicon, film bulk acoustic resonator (FBAR) radio frequency filters, and wireless connectivity components—through 2031. Broadcom will invest $1.5 billion to expand and modernize its manufacturing facilities in Fort Collins, Colorado.

The agreement locks in Broadcom as Apple's primary supplier for RF and wireless connectivity logic on all iPhones and devices through the decade. Broadcom had previously disclosed the deal in SEC filings; Apple's public announcement on July 8 attached the $30B+ valuation. This is part of Apple's broader $600 billion, four-year U.S. investment commitment announced in August 2025. By 2026, Broadcom expects the Apple deal to contribute roughly $6 billion annually in revenue.

For architects: the tier-one signal here is supply-chain lock-in, not price discovery. Apple is de-facto eliminating RF supply-chain risk heading into its AI server ramp (Project Baltra, slated 2027). Broadcom's fortress position in wireless components—paired with the tariff-shield value of U.S. manufacturing—makes this a capital commitment that Apple's new CEO John Ternus (taking over Sept. 1) will not renegotiate in his first year. Watch for similar long-term deals with packaging partners (Amkor, substrate makers) and logic fabs (Intel FOUNDRY) by end of H3 2026.