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Funding Baidu's Kunlunxin targets $50B Hong Kong IPO, ties chip purchases to allocations Funding Momenta launches Hong Kong IPO targeting $751M for autonomous driving R&D Chips HBM now comprises 35-47% of AI accelerator BOM; GB200 HBM alone costs $4,800/unit Market Samsung HBM4 revenue tops $1 billion; targets $10 billion run-rate by end-2026 Chips OpenAI, Broadcom unveil Jalapeño LLM inference chip; gigawatt-scale deployment targeted by end-2026 Market TSMC warns AI chip shortage to persist into 2027; signals 15% 3nm price increase H2 2026 Research DeepSeek V4 DSpark speculative decoding cuts inference latency 85%, hits Together AI Breaking OpenAI launches $150M Partner Network to certify 300K consultants by year-end Breaking HP becomes flagship Frontier adopter; OpenAI scales enterprise AI agent platform with consulting partnerships Breaking Apple lobbies White House for CXMT DRAM approval as memory costs hit 20% MacBook, iPad price hikes Funding Samsung, SK Hynix plan $1.3T capex over decade on AI memory demand Breaking Lenovo, NVIDIA Partner on AI Cloud Gigafactory; Reduce Inference Server Deployment Timelines from Months to Weeks Chips Google TPUs Power Anthropic Expansion; Up to 1M Ironwood Chips Lock $40B Multi-Gigawatt Capacity Deal Through 2027+ Chips NVIDIA confirms Vera Rubin full production; Rubin GPU leads AgentPerf with 20x efficiency over Hopper Policy FERC orders grid operators to fast-track AI data center connections; 60-day deadline to justify or rewrite tariffs Chips Coherent CHIPS grant $50M for indium phosphide fab expansion; quadruples Sherman wafer output for AI optical networking Chips NVIDIA partners with SK Hynix on next-gen AI memory; codeveloping for Vera Rubin and autonomous fabs Chips TSMC CoWoS hits 98% yield; SoW-X roadmap supports 64 HBM stacks; co-packaged optics production 2026 Chips PNY DDR5-5600 32GB hits $379.99 — cheapest 2x16GB kit amid RAM crisis; 16% discount Chips TSMC 2nm mass production hits 70% yield; Apple, NVIDIA locked in through 2026 Funding Baidu's Kunlunxin targets $50B Hong Kong IPO, ties chip purchases to allocations Funding Momenta launches Hong Kong IPO targeting $751M for autonomous driving R&D Chips HBM now comprises 35-47% of AI accelerator BOM; GB200 HBM alone costs $4,800/unit Market Samsung HBM4 revenue tops $1 billion; targets $10 billion run-rate by end-2026 Chips OpenAI, Broadcom unveil Jalapeño LLM inference chip; gigawatt-scale deployment targeted by end-2026 Market TSMC warns AI chip shortage to persist into 2027; signals 15% 3nm price increase H2 2026 Research DeepSeek V4 DSpark speculative decoding cuts inference latency 85%, hits Together AI Breaking OpenAI launches $150M Partner Network to certify 300K consultants by year-end Breaking HP becomes flagship Frontier adopter; OpenAI scales enterprise AI agent platform with consulting partnerships Breaking Apple lobbies White House for CXMT DRAM approval as memory costs hit 20% MacBook, iPad price hikes Funding Samsung, SK Hynix plan $1.3T capex over decade on AI memory demand Breaking Lenovo, NVIDIA Partner on AI Cloud Gigafactory; Reduce Inference Server Deployment Timelines from Months to Weeks Chips Google TPUs Power Anthropic Expansion; Up to 1M Ironwood Chips Lock $40B Multi-Gigawatt Capacity Deal Through 2027+ Chips NVIDIA confirms Vera Rubin full production; Rubin GPU leads AgentPerf with 20x efficiency over Hopper Policy FERC orders grid operators to fast-track AI data center connections; 60-day deadline to justify or rewrite tariffs Chips Coherent CHIPS grant $50M for indium phosphide fab expansion; quadruples Sherman wafer output for AI optical networking Chips NVIDIA partners with SK Hynix on next-gen AI memory; codeveloping for Vera Rubin and autonomous fabs Chips TSMC CoWoS hits 98% yield; SoW-X roadmap supports 64 HBM stacks; co-packaged optics production 2026 Chips PNY DDR5-5600 32GB hits $379.99 — cheapest 2x16GB kit amid RAM crisis; 16% discount Chips TSMC 2nm mass production hits 70% yield; Apple, NVIDIA locked in through 2026
Chips

Coherent CHIPS grant $50M for indium phosphide fab expansion; quadruples Sherman wafer output for AI optical networking

Coherent Corporation signed a letter of intent on June 16 to receive up to $50 million in direct CHIPS Act funding from the U.S. Department of Commerce to expand its 6-inch indium phosphide (InP) manufacturing facility in Sherman, Texas. The expansion, which broke ground the same day with NVIDIA CEO Jensen Huang in attendance, will double manufacturing production space and quadruple wafer production capacity, creating more than 1,000 jobs (550+ direct advanced manufacturing roles). Coherent's Sherman site is the world's first and largest volume-production 150mm indium phosphide fab.

Indium phosphide is a III-V compound semiconductor essential for AI optical interconnect infrastructure. Unlike silicon, InP enables high-speed lasers and photodiodes that operate at 1310nm and 1550nm wavelengths, the standards for fiber-optic data center communications. Coherent's InP-based photonic devices—including lasers, modulators, and photodetectors—are used in NVIDIA's pluggable optical transceivers and co-packaged optics switches. The expansion moves beyond historical 3-4 inch wafer production to 6-inch wafers, roughly quadrupling usable area per wafer and driving down per-unit optical interconnect costs. NVIDIA has deepened its partnership with Coherent as optical networking emerges as the next potential bottleneck in AI infrastructure.

For architects building hyperscale AI clusters, this expansion directly addresses the optical interconnect supply chain. As GPU counts scale and data center densities increase, bottleneck shifts from compute to networking; NVIDIA's push for co-packaged optics makes Coherent's InP capacity a strategic constraint. The CHIPS Act funding validates U.S. policy intent to secure photonics supply chains. The Sherman facility, once a quiet Texas operation, now sits at the center of national AI infrastructure strategy.

Sources