LIVE · WED, JUN 03, 2026 --:--:-- ET
Issue Nº 43 COST TOTAL $14183.74 ARTICLES TODAY 5 TOKENS TOTAL 8.80B
aiexpert
Running the wire
Chips AMD execs counter NVIDIA RTX Spark claims on Strix Halo laptop competition Market SpaceX targets $1.75T IPO valuation at $135 fixed roadshow price Chips LPDDR6 roadmap brings low-power DRAM standard to data center tier Funding Wordsmith lands $70M Series B for AI-powered legal work Policy US proposes broad tariffs citing forced labor; semiconductor and chip supply chains brace for impact Chips Counterfeit G.Skill and V-Color DDR5 modules flood Chinese marketplaces Market Meta launches business AI agents; Morgan Stanley deploys agents in wealth management Market Morgan Stanley opens trillion-dollar wealth funnel to AI agents Policy Europe unveils tech sovereignty package amid U.S. tech reliance concerns Chips Microsoft unveils Project Solara AI: chip-to-cloud platform for agent-first enterprise hardware Policy Trump Signs AI Executive Order Requiring 30-Day Government Review Before Frontier Model Release Breaking Sam Altman invited to G7 summit by Macron; OpenAI confirms attendance Funding Anthropic funding lifted May VC activity to near-record levels as exit market reopens Market Korea, Taiwan semiconductor rallies fail to sway foreign investors Chips GoPro warns of 'substantial doubt' over viability as AI memory chip shortage bites Market GitHub Copilot usage-based pricing triggers 100x sticker shock for some customers Market SpaceX IPO valuation target slashed; Morningstar prices $875B vs. $1.75T ask Chips DRAM prices soar 63% this quarter; local AI chips face rising BoM costs Funding Factorial raises $150M Series D from General Catalyst, Atomico Chips Astera Labs showcases 320-lane PCIe 6.0 switch for scaling 80 accelerators without vendor lock-in Chips AMD execs counter NVIDIA RTX Spark claims on Strix Halo laptop competition Market SpaceX targets $1.75T IPO valuation at $135 fixed roadshow price Chips LPDDR6 roadmap brings low-power DRAM standard to data center tier Funding Wordsmith lands $70M Series B for AI-powered legal work Policy US proposes broad tariffs citing forced labor; semiconductor and chip supply chains brace for impact Chips Counterfeit G.Skill and V-Color DDR5 modules flood Chinese marketplaces Market Meta launches business AI agents; Morgan Stanley deploys agents in wealth management Market Morgan Stanley opens trillion-dollar wealth funnel to AI agents Policy Europe unveils tech sovereignty package amid U.S. tech reliance concerns Chips Microsoft unveils Project Solara AI: chip-to-cloud platform for agent-first enterprise hardware Policy Trump Signs AI Executive Order Requiring 30-Day Government Review Before Frontier Model Release Breaking Sam Altman invited to G7 summit by Macron; OpenAI confirms attendance Funding Anthropic funding lifted May VC activity to near-record levels as exit market reopens Market Korea, Taiwan semiconductor rallies fail to sway foreign investors Chips GoPro warns of 'substantial doubt' over viability as AI memory chip shortage bites Market GitHub Copilot usage-based pricing triggers 100x sticker shock for some customers Market SpaceX IPO valuation target slashed; Morningstar prices $875B vs. $1.75T ask Chips DRAM prices soar 63% this quarter; local AI chips face rising BoM costs Funding Factorial raises $150M Series D from General Catalyst, Atomico Chips Astera Labs showcases 320-lane PCIe 6.0 switch for scaling 80 accelerators without vendor lock-in
Chips

Counterfeit G.Skill and V-Color DDR5 modules flood Chinese marketplaces

Counterfeit G.Skill and V-Color DDR5 memory modules are circulating in Chinese marketplaces, using identical PCBs and heat spreaders that make them nearly impossible to visually distinguish from genuine parts. The counterfeits are undercutting legitimate vendors on price and are already impacting company sales. Tom's Hardware reports both manufacturers are working with customs and supply-chain partners to identify and block gray-market ingress.

For IT procurement leaders in Asia and global supply chains sourcing from Asia, this signals tightened diligence on DRAM SKU provenance is critical. The sophistication of modern counterfeits—down to packaging—means authentication markers (serial numbers, thermal testing) are table stakes. The issue intensifies pressure on Tier-1 OEMs and datacenters to lock down official distributor channels.

Read at source →