Imec researcher Patrick Vandenameele told EE Times that full-stack innovation—integrating design, process, and architecture across the entire manufacturing pipeline—is essential for next-generation chip competitiveness. The perspective underscores a shift from point optimization to holistic silicon co-design.
For infrastructure and chip procurement teams, this signals that incremental fab improvements alone won't compete with comprehensive vertical-integration strategies. Organizations pursuing custom silicon or AI accelerators should expect partners to demand cross-layer collaboration and longer design cycles.