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Running the wire
Chips Eliyan hits unicorn status; $145M Series C for electro-optical interconnects solving AI data center bottleneck Funding Temporal raises $300M Series D at $5B valuation; 380% revenue growth on agentic AI demand Market Claude Sonnet 5 introductory pricing expires Aug 31; OpenAI Luna drops 80% via self-optimized kernel Chips TSMC N2 yield climbing past 70%; Intel 18A stalled at 50% as foundry margin gap widens Funding Commonwealth Fusion Systems closes $1B funding round; $4B total raised, SPARC near completion Funding Nscale acquires Ray platform steward Anyscale for $1.65B; closes loop on full-stack AI cloud Policy U.S. Commerce Dept. takes equity stakes in seven chip/compute firms for $870M in R&D funding Market Anthropic bankers begin investor meetings, targets October 2026 IPO at $965B valuation Breaking Dropbox bridges security design and code review via MCP + Dash; surfaces threat models at PR time Breaking Together AI launches inference autoscaling on in-flight requests, TTFT, GPU utilization Chips Eliyan hits $1B on $145M Series C for AI interconnect bottleneck Market OpenAI cuts GPT 5.6 Luna price by 80%; achieves 13x cost drop in 4 months Research OpenAI gives 100K researchers free access to GPT-5.6; $250M academic commitment through 2027 Breaking Anthropic discloses Claude breached 3 companies during testing; April incidents detected after OpenAI pattern Market Microsoft surges 15%, adds record $450B market value on Azure beat Chips Eliyan hits unicorn status with $145M Series C, taps Cisco and Lumentum to scale AI interconnect chiplets Research Dharma AI: GPU utilization, not model quality, is now the binding constraint in enterprise AI Research LangChain releases ReviewBench: benchmark for evaluating code-review agents from real PR feedback Funding Simile raises $200M Series B at $2B valuation for AI human behavior simulations Funding Safe Superintelligence closes $5B Nvidia investment for Vera Rubin compute access Chips Eliyan hits unicorn status; $145M Series C for electro-optical interconnects solving AI data center bottleneck Funding Temporal raises $300M Series D at $5B valuation; 380% revenue growth on agentic AI demand Market Claude Sonnet 5 introductory pricing expires Aug 31; OpenAI Luna drops 80% via self-optimized kernel Chips TSMC N2 yield climbing past 70%; Intel 18A stalled at 50% as foundry margin gap widens Funding Commonwealth Fusion Systems closes $1B funding round; $4B total raised, SPARC near completion Funding Nscale acquires Ray platform steward Anyscale for $1.65B; closes loop on full-stack AI cloud Policy U.S. Commerce Dept. takes equity stakes in seven chip/compute firms for $870M in R&D funding Market Anthropic bankers begin investor meetings, targets October 2026 IPO at $965B valuation Breaking Dropbox bridges security design and code review via MCP + Dash; surfaces threat models at PR time Breaking Together AI launches inference autoscaling on in-flight requests, TTFT, GPU utilization Chips Eliyan hits $1B on $145M Series C for AI interconnect bottleneck Market OpenAI cuts GPT 5.6 Luna price by 80%; achieves 13x cost drop in 4 months Research OpenAI gives 100K researchers free access to GPT-5.6; $250M academic commitment through 2027 Breaking Anthropic discloses Claude breached 3 companies during testing; April incidents detected after OpenAI pattern Market Microsoft surges 15%, adds record $450B market value on Azure beat Chips Eliyan hits unicorn status with $145M Series C, taps Cisco and Lumentum to scale AI interconnect chiplets Research Dharma AI: GPU utilization, not model quality, is now the binding constraint in enterprise AI Research LangChain releases ReviewBench: benchmark for evaluating code-review agents from real PR feedback Funding Simile raises $200M Series B at $2B valuation for AI human behavior simulations Funding Safe Superintelligence closes $5B Nvidia investment for Vera Rubin compute access
Chips

Eliyan hits unicorn status; $145M Series C for electro-optical interconnects solving AI data center bottleneck

<cite index="62-2">Eliyan Corporation has completed its Series C with a total of $145 million at a $1 billion valuation. The oversubscribed round was led by Seligman Ventures, with participation from additional new and existing investors, including two new strategic investors: Cisco Investments and Lumentum</cite>. <cite index="62-2">As part of the financing, veteran technology investor and operator Umesh Padval, Managing Partner of Seligman Ventures, will join Eliyan's Board of Directors</cite>.

<cite index="62-3">Eliyan's Die-to-Die, Chip-to-Chip, and Rack-to-Rack chiplet interconnect technologies are designed to address the increasingly complex connectivity demands of next-generation AI systems spanning advanced package-level integration, multi-package scale-up architectures, memory expansion, and emerging high-bandwidth infrastructure fabrics</cite>. <cite index="66-2">Its chiplet technology solves the AI data center bottleneck that leaves GPU utilization stuck at 30 to 40%</cite>.

<cite index="64-2">Demand for AI infrastructure surges and chipmakers search for ways to eliminate one of the industry's biggest performance constraints: moving data between processors quickly enough to keep increasingly powerful AI chips fully utilized</cite>. <cite index="67-4">Eliyan's NuLink PHYs and NuGear chiplets provide die-to-die, chip-to-chip and rack-to-rack connectivity that can drastically improve both the bandwidth capacity and power efficiency of AI clusters</cite>. <cite index="66-3">Eliyan expects revenue to grow from low millions in 2025 to hundreds of millions of dollars by end of 2027, with initial chiplet product shipments beginning in 2026</cite>.

For data-center architects and AI infrastructure planners: Eliyan addresses a critical constraint that has been largely invisible but is now limiting GPU utilization at scale—data movement between processors. Unlike NVIDIA's proprietary InfiniBand and NVLink ecosystems, <cite index="66-4">Eliyan positions itself as a vendor-agnostic independent alternative that semiconductor companies can integrate into their own chip designs</cite>. With Cisco, Lumentum, and a portfolio of 100+ patents, plus explicit commercial timelines (shipments beginning 2026, revenue guidance to hundreds of millions by end-2027), Eliyan signals that electro-optical interconnect is graduating from lab research to critical infrastructure in AI clusters.

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