LIVE · WED, JUN 10, 2026 --:--:-- ET

Issue Nº 50 COST TOTAL $14278.73 ARTICLES TODAY 17 TOKENS TOTAL 8.87B

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Funding Google DeepMind Selects Startups for First Robotics Accelerator Program Chips Intel Z790, Z990 Flagship Chipsets Consume 14W at Peak; Nova Lake Motherboards Shrink PCH by 22% Chips Startup Ricursive Aims to Build End-to-End AI Model for Chip Design Chips NVIDIA Accelerates Google DeepMind's DiffusionGemma for Local AI Inference Funding Humanoid robotics startup raises up to $1.4B from NVIDIA, Amazon, others Chips AMD claims 256-core Zen 6 Venice CPU beats NVIDIA Vera 3.3x in rack-level performance Chips Google books Intel for packaging over 3M TPUs in 2028 Market Palantir CEO Karp: enterprises are 'unhappy' with frontier AI labs' pace and pricing Funding Neura Robotics raises $1.4B Series C backed by Amazon, NVIDIA, Qualcomm Market SpaceX primed for double-digit IPO pop; perps traders bet on 50%+ first-day surge Chips Samsung, Supermicro build 50MW floating AI data centers powered by fuel cells Breaking CNBC: AI Automating Youth Workforce; Thoma Bravo Sees Accelerated Maturation Cycle Market Amazon Trucking Expansion Sparks Freight Sector Selloff Chips AI Storage Demand Creates Memory Wall; IT Budgets Under Pressure Research Beyond Prompting: Context Engineering and Memory Management Scale AI Systems Policy Revolut Product Blitz Curbed by European Authorities; Regulatory Pressure Mounts Market US Inflation Accelerates to Three-Year High; Core Gauge Softens Slightly Breaking Databricks Storage Ecosystem Lets Enterprises Govern Data Anywhere Market Bond Traders Keep Bets on Fed Hike This Year After Tame CPI Report Market SpaceX IPO draws billions in orders from Middle Eastern sovereign funds Funding Google DeepMind Selects Startups for First Robotics Accelerator Program Chips Intel Z790, Z990 Flagship Chipsets Consume 14W at Peak; Nova Lake Motherboards Shrink PCH by 22% Chips Startup Ricursive Aims to Build End-to-End AI Model for Chip Design Chips NVIDIA Accelerates Google DeepMind's DiffusionGemma for Local AI Inference Funding Humanoid robotics startup raises up to $1.4B from NVIDIA, Amazon, others Chips AMD claims 256-core Zen 6 Venice CPU beats NVIDIA Vera 3.3x in rack-level performance Chips Google books Intel for packaging over 3M TPUs in 2028 Market Palantir CEO Karp: enterprises are 'unhappy' with frontier AI labs' pace and pricing Funding Neura Robotics raises $1.4B Series C backed by Amazon, NVIDIA, Qualcomm Market SpaceX primed for double-digit IPO pop; perps traders bet on 50%+ first-day surge Chips Samsung, Supermicro build 50MW floating AI data centers powered by fuel cells Breaking CNBC: AI Automating Youth Workforce; Thoma Bravo Sees Accelerated Maturation Cycle Market Amazon Trucking Expansion Sparks Freight Sector Selloff Chips AI Storage Demand Creates Memory Wall; IT Budgets Under Pressure Research Beyond Prompting: Context Engineering and Memory Management Scale AI Systems Policy Revolut Product Blitz Curbed by European Authorities; Regulatory Pressure Mounts Market US Inflation Accelerates to Three-Year High; Core Gauge Softens Slightly Breaking Databricks Storage Ecosystem Lets Enterprises Govern Data Anywhere Market Bond Traders Keep Bets on Fed Hike This Year After Tame CPI Report Market SpaceX IPO draws billions in orders from Middle Eastern sovereign funds

Chips Wednesday, June 10, 2026 at 04:01 PM

Google books Intel for packaging over 3M TPUs in 2028

Google has reportedly contracted Intel for packaging and assembly of more than 3 million custom TPUs in 2028, leveraging Intel's EMIB (Embedded Multi-die Interconnect Bridge) technology alongside SK hynix HBM integration.

The deal underscores the scale of AI silicon demand and Intel's pivot toward foundry services; EMIB packaging addresses the memory-bandwidth bottleneck critical for AI workloads, extending Intel's relevance in the AI accelerator supply chain beyond process node competition.

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