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Funding Baidu's Kunlunxin targets $50B Hong Kong IPO, ties chip purchases to allocations Funding Momenta launches Hong Kong IPO targeting $751M for autonomous driving R&D Chips HBM now comprises 35-47% of AI accelerator BOM; GB200 HBM alone costs $4,800/unit Market Samsung HBM4 revenue tops $1 billion; targets $10 billion run-rate by end-2026 Chips OpenAI, Broadcom unveil Jalapeño LLM inference chip; gigawatt-scale deployment targeted by end-2026 Market TSMC warns AI chip shortage to persist into 2027; signals 15% 3nm price increase H2 2026 Research DeepSeek V4 DSpark speculative decoding cuts inference latency 85%, hits Together AI Breaking OpenAI launches $150M Partner Network to certify 300K consultants by year-end Breaking HP becomes flagship Frontier adopter; OpenAI scales enterprise AI agent platform with consulting partnerships Breaking Apple lobbies White House for CXMT DRAM approval as memory costs hit 20% MacBook, iPad price hikes Funding Samsung, SK Hynix plan $1.3T capex over decade on AI memory demand Breaking Lenovo, NVIDIA Partner on AI Cloud Gigafactory; Reduce Inference Server Deployment Timelines from Months to Weeks Chips Google TPUs Power Anthropic Expansion; Up to 1M Ironwood Chips Lock $40B Multi-Gigawatt Capacity Deal Through 2027+ Chips NVIDIA confirms Vera Rubin full production; Rubin GPU leads AgentPerf with 20x efficiency over Hopper Policy FERC orders grid operators to fast-track AI data center connections; 60-day deadline to justify or rewrite tariffs Chips Coherent CHIPS grant $50M for indium phosphide fab expansion; quadruples Sherman wafer output for AI optical networking Chips NVIDIA partners with SK Hynix on next-gen AI memory; codeveloping for Vera Rubin and autonomous fabs Chips TSMC CoWoS hits 98% yield; SoW-X roadmap supports 64 HBM stacks; co-packaged optics production 2026 Chips PNY DDR5-5600 32GB hits $379.99 — cheapest 2x16GB kit amid RAM crisis; 16% discount Chips TSMC 2nm mass production hits 70% yield; Apple, NVIDIA locked in through 2026 Funding Baidu's Kunlunxin targets $50B Hong Kong IPO, ties chip purchases to allocations Funding Momenta launches Hong Kong IPO targeting $751M for autonomous driving R&D Chips HBM now comprises 35-47% of AI accelerator BOM; GB200 HBM alone costs $4,800/unit Market Samsung HBM4 revenue tops $1 billion; targets $10 billion run-rate by end-2026 Chips OpenAI, Broadcom unveil Jalapeño LLM inference chip; gigawatt-scale deployment targeted by end-2026 Market TSMC warns AI chip shortage to persist into 2027; signals 15% 3nm price increase H2 2026 Research DeepSeek V4 DSpark speculative decoding cuts inference latency 85%, hits Together AI Breaking OpenAI launches $150M Partner Network to certify 300K consultants by year-end Breaking HP becomes flagship Frontier adopter; OpenAI scales enterprise AI agent platform with consulting partnerships Breaking Apple lobbies White House for CXMT DRAM approval as memory costs hit 20% MacBook, iPad price hikes Funding Samsung, SK Hynix plan $1.3T capex over decade on AI memory demand Breaking Lenovo, NVIDIA Partner on AI Cloud Gigafactory; Reduce Inference Server Deployment Timelines from Months to Weeks Chips Google TPUs Power Anthropic Expansion; Up to 1M Ironwood Chips Lock $40B Multi-Gigawatt Capacity Deal Through 2027+ Chips NVIDIA confirms Vera Rubin full production; Rubin GPU leads AgentPerf with 20x efficiency over Hopper Policy FERC orders grid operators to fast-track AI data center connections; 60-day deadline to justify or rewrite tariffs Chips Coherent CHIPS grant $50M for indium phosphide fab expansion; quadruples Sherman wafer output for AI optical networking Chips NVIDIA partners with SK Hynix on next-gen AI memory; codeveloping for Vera Rubin and autonomous fabs Chips TSMC CoWoS hits 98% yield; SoW-X roadmap supports 64 HBM stacks; co-packaged optics production 2026 Chips PNY DDR5-5600 32GB hits $379.99 — cheapest 2x16GB kit amid RAM crisis; 16% discount Chips TSMC 2nm mass production hits 70% yield; Apple, NVIDIA locked in through 2026
Chips

Google TPUs Power Anthropic Expansion; Up to 1M Ironwood Chips Lock $40B Multi-Gigawatt Capacity Deal Through 2027+

The Anthropic deal covers 5 gigawatts of TPU capacity and is worth up to $40 billion, marking Google's largest commercial commitment of its custom silicon to a single external customer. The expansion will provide Anthropic with multiple gigawatts of TPU capacity, expected to come online starting in 2027, via Google Cloud services as well as access to Google-built TPUs supplied through Broadcom.

Each Ironwood chip delivers 4,614 TFLOPs of FP8 compute with 192 GB of HBM3e memory and 7.4 TB/s of memory bandwidth, with Google claiming a 10x peak performance improvement over TPU v5p. The volume signals Google's conviction that custom silicon, not just rented GPU clusters, will define the economics of AI inference at scale. Semianalysis argues Google is the newest and most threatening merchant silicon challenger to Nvidia, noting that Anthropic will deploy TPUs in its own facilities, positioning Google to compete directly with Nvidia.

For infrastructure architects evaluating AI accelerator procurement, Google's TPU capacity deals represent a viable cost/performance alternative to NVIDIA GPUs for inference-heavy workloads. Training large language models on TPUs can be 40–60% cheaper than equivalent GPU workloads, according to Google Cloud's estimates, though supply is now committed through major partners through 2027–2028.

Sources