India targets chip design and manufacturing leadership by 2035
India has outlined a 2035 semiconductor roadmap prioritizing targeted design capability and manufacturing leadership, EE Times reports. The strategy signals New Delhi's pivot from assembly-and-test to indigenous IP, fab capacity, and R&D infrastructure—directly challenging TSMC and Samsung's regional dominance.
Geopolitical semiconductor fragmentation and US export controls on leading-edge chip tech are creating openings for state-backed alternative fabs and design ecosystems. India's explicit 2035 horizon suggests capital commitments and talent recruitment pipelines already underway, positioning the subcontinent as a secondary supply base for non-US alliance partners.