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Issue Nº 35 COST TOTAL $11573.08 ARTICLES TODAY 10 TOKENS TOTAL 6.77B
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Chips LightSpeed Photonics targets AI data centers with 400-Gbps optical interconnects Breaking Google expands SynthID AI watermarking, previews content detection API Funding General Catalyst backs YC alum Lucis in $20M Series A for preventive health Chips Actions Technology traces audio chip evolution from obscurity to ubiquity Market Taiwan Stock Market Overtakes India as World's Fifth-Largest, Powered by TSMC Rise Market ASX ramps up capex spending to accelerate technology infrastructure upgrade Breaking Microsoft open-sources MDASH for large-scale AI vulnerability research Breaking OpenAI partners with Grupo Folha and Grupo UOL on strategic content partnership; Brazilian media expansion Chips Imec builds first High-NA EUV quantum dot qubit using next-gen fab process Chips Chinese GPU maker sells out 30,000 units of LX 7G100 within 48 hours Research Gemma 4 Multi-Token Prediction Delivers up to 3x Faster Token Generation Funding Most Active Legaltech Investors in Europe Identified in New Sifted Analysis Policy European Sovereignty Push Faces Corporate Welfare Concerns in AI Funding Market AI Rally Hits Global Momentum Stocks with Record Consecutive Gains Breaking Google Introduces Middleware Architecture for Genkit Applications Breaking Supermicro faces $2.5B smuggling bust; Nvidia CEO urges export control tightening Chips AMD RX 9070 XT Advanced Shader Delivery: up to 95% faster load times in testing Chips Researcher develops spray-on stealth coating for drones with 43dB radar reduction Breaking AWS MCP Server reaches general availability with full API coverage and IAM governance Chips LightSpeed Photonics targets AI data centers with 400-Gbps optical interconnects Breaking Google expands SynthID AI watermarking, previews content detection API Funding General Catalyst backs YC alum Lucis in $20M Series A for preventive health Chips Actions Technology traces audio chip evolution from obscurity to ubiquity Market Taiwan Stock Market Overtakes India as World's Fifth-Largest, Powered by TSMC Rise Market ASX ramps up capex spending to accelerate technology infrastructure upgrade Breaking Microsoft open-sources MDASH for large-scale AI vulnerability research Breaking OpenAI partners with Grupo Folha and Grupo UOL on strategic content partnership; Brazilian media expansion Chips Imec builds first High-NA EUV quantum dot qubit using next-gen fab process Chips Chinese GPU maker sells out 30,000 units of LX 7G100 within 48 hours Research Gemma 4 Multi-Token Prediction Delivers up to 3x Faster Token Generation Funding Most Active Legaltech Investors in Europe Identified in New Sifted Analysis Policy European Sovereignty Push Faces Corporate Welfare Concerns in AI Funding Market AI Rally Hits Global Momentum Stocks with Record Consecutive Gains Breaking Google Introduces Middleware Architecture for Genkit Applications Breaking Supermicro faces $2.5B smuggling bust; Nvidia CEO urges export control tightening Chips AMD RX 9070 XT Advanced Shader Delivery: up to 95% faster load times in testing Chips Researcher develops spray-on stealth coating for drones with 43dB radar reduction Breaking AWS MCP Server reaches general availability with full API coverage and IAM governance
Chips

LightSpeed Photonics targets AI data centers with 400-Gbps optical interconnects

LightSpeed Photonics is launching 400-Gbps near-packaged optical interconnect modules for AI data centers, addressing the interconnect bottleneck between GPU clusters. The technology aims to reduce latency and power consumption in large-scale model training and inference, where electrical interconnect bandwidth and thermal overhead increasingly constrain scaling.

The product fills a gap in the AI infrastructure stack for large-cluster operators and cloud providers managing dense GPU aggregations, positioning optical I/O as a critical efficiency lever for next-generation training farms.

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