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Funding Baidu's Kunlunxin targets $50B Hong Kong IPO, ties chip purchases to allocations Funding Momenta launches Hong Kong IPO targeting $751M for autonomous driving R&D Chips HBM now comprises 35-47% of AI accelerator BOM; GB200 HBM alone costs $4,800/unit Market Samsung HBM4 revenue tops $1 billion; targets $10 billion run-rate by end-2026 Chips OpenAI, Broadcom unveil Jalapeño LLM inference chip; gigawatt-scale deployment targeted by end-2026 Market TSMC warns AI chip shortage to persist into 2027; signals 15% 3nm price increase H2 2026 Research DeepSeek V4 DSpark speculative decoding cuts inference latency 85%, hits Together AI Breaking OpenAI launches $150M Partner Network to certify 300K consultants by year-end Breaking HP becomes flagship Frontier adopter; OpenAI scales enterprise AI agent platform with consulting partnerships Breaking Apple lobbies White House for CXMT DRAM approval as memory costs hit 20% MacBook, iPad price hikes Funding Samsung, SK Hynix plan $1.3T capex over decade on AI memory demand Breaking Lenovo, NVIDIA Partner on AI Cloud Gigafactory; Reduce Inference Server Deployment Timelines from Months to Weeks Chips Google TPUs Power Anthropic Expansion; Up to 1M Ironwood Chips Lock $40B Multi-Gigawatt Capacity Deal Through 2027+ Chips NVIDIA confirms Vera Rubin full production; Rubin GPU leads AgentPerf with 20x efficiency over Hopper Policy FERC orders grid operators to fast-track AI data center connections; 60-day deadline to justify or rewrite tariffs Chips Coherent CHIPS grant $50M for indium phosphide fab expansion; quadruples Sherman wafer output for AI optical networking Chips NVIDIA partners with SK Hynix on next-gen AI memory; codeveloping for Vera Rubin and autonomous fabs Chips TSMC CoWoS hits 98% yield; SoW-X roadmap supports 64 HBM stacks; co-packaged optics production 2026 Chips PNY DDR5-5600 32GB hits $379.99 — cheapest 2x16GB kit amid RAM crisis; 16% discount Chips TSMC 2nm mass production hits 70% yield; Apple, NVIDIA locked in through 2026 Funding Baidu's Kunlunxin targets $50B Hong Kong IPO, ties chip purchases to allocations Funding Momenta launches Hong Kong IPO targeting $751M for autonomous driving R&D Chips HBM now comprises 35-47% of AI accelerator BOM; GB200 HBM alone costs $4,800/unit Market Samsung HBM4 revenue tops $1 billion; targets $10 billion run-rate by end-2026 Chips OpenAI, Broadcom unveil Jalapeño LLM inference chip; gigawatt-scale deployment targeted by end-2026 Market TSMC warns AI chip shortage to persist into 2027; signals 15% 3nm price increase H2 2026 Research DeepSeek V4 DSpark speculative decoding cuts inference latency 85%, hits Together AI Breaking OpenAI launches $150M Partner Network to certify 300K consultants by year-end Breaking HP becomes flagship Frontier adopter; OpenAI scales enterprise AI agent platform with consulting partnerships Breaking Apple lobbies White House for CXMT DRAM approval as memory costs hit 20% MacBook, iPad price hikes Funding Samsung, SK Hynix plan $1.3T capex over decade on AI memory demand Breaking Lenovo, NVIDIA Partner on AI Cloud Gigafactory; Reduce Inference Server Deployment Timelines from Months to Weeks Chips Google TPUs Power Anthropic Expansion; Up to 1M Ironwood Chips Lock $40B Multi-Gigawatt Capacity Deal Through 2027+ Chips NVIDIA confirms Vera Rubin full production; Rubin GPU leads AgentPerf with 20x efficiency over Hopper Policy FERC orders grid operators to fast-track AI data center connections; 60-day deadline to justify or rewrite tariffs Chips Coherent CHIPS grant $50M for indium phosphide fab expansion; quadruples Sherman wafer output for AI optical networking Chips NVIDIA partners with SK Hynix on next-gen AI memory; codeveloping for Vera Rubin and autonomous fabs Chips TSMC CoWoS hits 98% yield; SoW-X roadmap supports 64 HBM stacks; co-packaged optics production 2026 Chips PNY DDR5-5600 32GB hits $379.99 — cheapest 2x16GB kit amid RAM crisis; 16% discount Chips TSMC 2nm mass production hits 70% yield; Apple, NVIDIA locked in through 2026
Chips

NVIDIA partners with SK Hynix on next-gen AI memory; codeveloping for Vera Rubin and autonomous fabs

NVIDIA and SK Hynix announced a multiyear technology partnership on June 7 to codevelop next-generation memory for the global AI factory buildout, with SK Hynix committing supply aligned to NVIDIA's infrastructure roadmap spanning AI supercomputers, personal AI PCs, and robotic platforms. The deal builds on years of deep co-engineering collaboration and addresses the extended development cycles of advanced memory as AI factories scale globally. SK Hynix will codevelop memory for NVIDIA Vera Rubin AI supercomputers, Vera CPUs, RTX Spark-powered PCs and Jetson Thor robotic computing platforms.

Beyond memory codevelopment, the two companies will apply NVIDIA's CUDA-X libraries and PhysicsNeMo framework to accelerate SK Hynix's semiconductor simulation and design workflows. SK Hynix is also developing fab digital twins using NVIDIA Omniverse libraries and OpenUSD pipelines to enable autonomous manufacturing operations using NVIDIA's cuOpt decision optimization engine. The partnership does not disclose financial terms, duration, or specific volume commitments, but signals deep alignment on AI memory supply as a strategic advantage.

For architects planning multi-year AI infrastructure deployments, this partnership tightens memory supply visibility and links SK Hynix's next-generation capacity directly to NVIDIA's hardware roadmap. However, memory prices will remain elevated; the deal codifies supply prioritization for NVIDIA platforms over commodity DRAM markets. SK Hynix' dual commitment to capacity expansion and AI-accelerated fab automation suggests sustained investment in manufacturing efficiency, though relief on DRAM/HBM costs remains a multi-year story.

Sources