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Running the wire
Funding XCures closes $46M Series B round at $127M post-money valuation Funding Qualcomm acquires Modular for ~$4B to bolster AI software stack and data center play Chips OpenAI & Broadcom unveil Jalapeño, custom LLM inference chip with 9-month design cycle Chips SK Hynix ships HBM4E memory samples: 16Gbps, 48GB per stack, 20% power gain Funding Qualcomm in talks to acquire Tenstorrent for $8–10B, expanding RISC-V AI chip portfolio Chips TSMC hikes advanced node prices 5–10% across 7nm and newer nodes Chips OpenAI unveils Jalapeño custom inference chip with Broadcom Chips OpenAI-Broadcom custom chip project stalls; Broadcom demands Microsoft purchase guarantee before funding Market Cerebras Q1 profit beats but warns gross margins compress to 36–38% in Q2 Funding SK hynix files for $29.4B Nasdaq listing to fund AI memory fabs and EUV tools Breaking Microsoft AKS on bare metal reaches public preview; adds Ray and Fleet Manager for edge-to-cloud AI Research GPT-5 solves 3-year T cell mystery in minutes; suggests deoxyglucose-IL-2 mechanism, enables wet-lab validation Policy EU proposes Chips Act 2.0 to strengthen semiconductor capacity, reduce strategic dependencies Market SK Hynix plans $29B Nasdaq ADR listing on July 10, eyes HBM supply dominance Chips ASE raises 2026 capex to record $8.5B on AI packaging demand; LEAP revenue up 118% YoY Funding ByteDance seeks $20B offshore loan to fund $70-100B annual AI capex race Policy EU Chips Act 2.0 shifts focus from fab capacity to chip demand, design, and full value chain Policy EU Commission proposes Chips Act 2.0 to bolster chip independence, target €20B in funding Chips NVIDIA A100 black market prices triple in China amid U.S. smuggling crackdown and customs freeze Policy US awards SandboxAQ $500M CHIPS grant for AI-driven semiconductor materials discovery Funding XCures closes $46M Series B round at $127M post-money valuation Funding Qualcomm acquires Modular for ~$4B to bolster AI software stack and data center play Chips OpenAI & Broadcom unveil Jalapeño, custom LLM inference chip with 9-month design cycle Chips SK Hynix ships HBM4E memory samples: 16Gbps, 48GB per stack, 20% power gain Funding Qualcomm in talks to acquire Tenstorrent for $8–10B, expanding RISC-V AI chip portfolio Chips TSMC hikes advanced node prices 5–10% across 7nm and newer nodes Chips OpenAI unveils Jalapeño custom inference chip with Broadcom Chips OpenAI-Broadcom custom chip project stalls; Broadcom demands Microsoft purchase guarantee before funding Market Cerebras Q1 profit beats but warns gross margins compress to 36–38% in Q2 Funding SK hynix files for $29.4B Nasdaq listing to fund AI memory fabs and EUV tools Breaking Microsoft AKS on bare metal reaches public preview; adds Ray and Fleet Manager for edge-to-cloud AI Research GPT-5 solves 3-year T cell mystery in minutes; suggests deoxyglucose-IL-2 mechanism, enables wet-lab validation Policy EU proposes Chips Act 2.0 to strengthen semiconductor capacity, reduce strategic dependencies Market SK Hynix plans $29B Nasdaq ADR listing on July 10, eyes HBM supply dominance Chips ASE raises 2026 capex to record $8.5B on AI packaging demand; LEAP revenue up 118% YoY Funding ByteDance seeks $20B offshore loan to fund $70-100B annual AI capex race Policy EU Chips Act 2.0 shifts focus from fab capacity to chip demand, design, and full value chain Policy EU Commission proposes Chips Act 2.0 to bolster chip independence, target €20B in funding Chips NVIDIA A100 black market prices triple in China amid U.S. smuggling crackdown and customs freeze Policy US awards SandboxAQ $500M CHIPS grant for AI-driven semiconductor materials discovery
Chips

OpenAI-Broadcom custom chip project stalls; Broadcom demands Microsoft purchase guarantee before funding

OpenAI's Project Nexus—a collaboration with Broadcom to design and deploy 10 gigawatts of custom AI inference chips (first chip codenamed 'Jalapeno') by 2030—has hit a critical financing roadblock. Broadcom has declined to fund the first phase (estimated $18 billion for 1.3 GW capacity) unless Microsoft commits to purchasing roughly 40% of the chips and installing them in its own data centers before leasing back to OpenAI.

Microsoft has reserved data center space but has not formally agreed to purchase, citing disagreement over infrastructure design: OpenAI envisions specialized centers optimized for custom silicon, while Microsoft prefers standard, versatile data center architecture. An internal OpenAI memo noted that Microsoft 'has always held the leverage' in the chip strategy. The full Nexus plan could cost up to $180 billion in chip production alone (not including data center construction or power).

For architects evaluating AI infrastructure strategy and capex planning, this delay signals that even well-capitalized labs face financing constraints on custom silicon at scale. The absence of a Microsoft purchase agreement exposes OpenAI's dependency and raises questions about timeline: Jalapeno is not expected until 2027, adding pressure to Nvidia's near-term margin outlook if OpenAI defers custom silicon investments.

Source: the-decoder.com →