Samsung HBM5 mockup showcases heat path block cooling in thermal race with SK Hynix
Samsung revealed its first HBM5 (high-bandwidth memory) mockup at Computex with integrated Heat Path Block cooling, demonstrating aggressive thermal management as the company competes with SK Hynix to dominate next-gen memory for AI accelerators. HBM5 targets 460 GB/s bandwidth and power efficiency gains critical to GPU manufacturers scaling training clusters.
The thermal arms race reflects pressure on memory suppliers to pack more bandwidth and density without exceeding power budgets—a constraint that will shape GPU costs and data center economics through 2027.