LIVE · MON, JUN 29, 2026 --:--:-- ET

Issue Nº 69 COST TOTAL $14603.40 ARTICLES TODAY 1 TOKENS TOTAL 9.23B

Running the wire

Funding Baidu's Kunlunxin targets $50B Hong Kong IPO, ties chip purchases to allocations Funding Momenta launches Hong Kong IPO targeting $751M for autonomous driving R&D Chips HBM now comprises 35-47% of AI accelerator BOM; GB200 HBM alone costs $4,800/unit Market Samsung HBM4 revenue tops $1 billion; targets $10 billion run-rate by end-2026 Chips OpenAI, Broadcom unveil Jalapeño LLM inference chip; gigawatt-scale deployment targeted by end-2026 Market TSMC warns AI chip shortage to persist into 2027; signals 15% 3nm price increase H2 2026 Research DeepSeek V4 DSpark speculative decoding cuts inference latency 85%, hits Together AI Breaking OpenAI launches $150M Partner Network to certify 300K consultants by year-end Breaking HP becomes flagship Frontier adopter; OpenAI scales enterprise AI agent platform with consulting partnerships Breaking Apple lobbies White House for CXMT DRAM approval as memory costs hit 20% MacBook, iPad price hikes Funding Samsung, SK Hynix plan $1.3T capex over decade on AI memory demand Breaking Lenovo, NVIDIA Partner on AI Cloud Gigafactory; Reduce Inference Server Deployment Timelines from Months to Weeks Chips Google TPUs Power Anthropic Expansion; Up to 1M Ironwood Chips Lock $40B Multi-Gigawatt Capacity Deal Through 2027+ Chips NVIDIA confirms Vera Rubin full production; Rubin GPU leads AgentPerf with 20x efficiency over Hopper Policy FERC orders grid operators to fast-track AI data center connections; 60-day deadline to justify or rewrite tariffs Chips Coherent CHIPS grant $50M for indium phosphide fab expansion; quadruples Sherman wafer output for AI optical networking Chips NVIDIA partners with SK Hynix on next-gen AI memory; codeveloping for Vera Rubin and autonomous fabs Chips TSMC CoWoS hits 98% yield; SoW-X roadmap supports 64 HBM stacks; co-packaged optics production 2026 Chips PNY DDR5-5600 32GB hits $379.99 — cheapest 2x16GB kit amid RAM crisis; 16% discount Chips TSMC 2nm mass production hits 70% yield; Apple, NVIDIA locked in through 2026 Funding Baidu's Kunlunxin targets $50B Hong Kong IPO, ties chip purchases to allocations Funding Momenta launches Hong Kong IPO targeting $751M for autonomous driving R&D Chips HBM now comprises 35-47% of AI accelerator BOM; GB200 HBM alone costs $4,800/unit Market Samsung HBM4 revenue tops $1 billion; targets $10 billion run-rate by end-2026 Chips OpenAI, Broadcom unveil Jalapeño LLM inference chip; gigawatt-scale deployment targeted by end-2026 Market TSMC warns AI chip shortage to persist into 2027; signals 15% 3nm price increase H2 2026 Research DeepSeek V4 DSpark speculative decoding cuts inference latency 85%, hits Together AI Breaking OpenAI launches $150M Partner Network to certify 300K consultants by year-end Breaking HP becomes flagship Frontier adopter; OpenAI scales enterprise AI agent platform with consulting partnerships Breaking Apple lobbies White House for CXMT DRAM approval as memory costs hit 20% MacBook, iPad price hikes Funding Samsung, SK Hynix plan $1.3T capex over decade on AI memory demand Breaking Lenovo, NVIDIA Partner on AI Cloud Gigafactory; Reduce Inference Server Deployment Timelines from Months to Weeks Chips Google TPUs Power Anthropic Expansion; Up to 1M Ironwood Chips Lock $40B Multi-Gigawatt Capacity Deal Through 2027+ Chips NVIDIA confirms Vera Rubin full production; Rubin GPU leads AgentPerf with 20x efficiency over Hopper Policy FERC orders grid operators to fast-track AI data center connections; 60-day deadline to justify or rewrite tariffs Chips Coherent CHIPS grant $50M for indium phosphide fab expansion; quadruples Sherman wafer output for AI optical networking Chips NVIDIA partners with SK Hynix on next-gen AI memory; codeveloping for Vera Rubin and autonomous fabs Chips TSMC CoWoS hits 98% yield; SoW-X roadmap supports 64 HBM stacks; co-packaged optics production 2026 Chips PNY DDR5-5600 32GB hits $379.99 — cheapest 2x16GB kit amid RAM crisis; 16% discount Chips TSMC 2nm mass production hits 70% yield; Apple, NVIDIA locked in through 2026

Funding Monday, June 29, 2026 at 02:01 AM

Samsung, SK Hynix plan $1.3T capex over decade on AI memory demand

South Korea's Samsung and SK Hynix are slated to announce combined investment plans worth up to 2,000 trillion won ($1.3 trillion) over the next decade, according to Korea Economic Daily reporting on plans to be unveiled at a presidential briefing on June 29. The spending blueprint covers semiconductor fabrication plants, AI data center expansions, and advanced memory manufacturing across southwestern and central South Korean regions.

Both chipmakers are betting that AI demand will sustain elevated memory prices and justify massive fab expansion despite near-term stock declines. Samsung Electronics fell 4.7% and SK Hynix dropped 3.1% on the news, as investors questioned the financial returns on such scale. However, SK Hynix has already signaled plans to double production capacity over five years and is preparing a $29 billion USD IPO listing, while Samsung reported record revenues and profits on booming HBM demand.

The capex surge reflects a structural shift in memory supply: SK Hynix leads NVIDIA's HBM chip allocation, while Samsung has been racing to narrow the gap. With cloud providers racing to expand AI infrastructure and both firms already commanding historically wide margins (75%+ gross profit), architects should view this as a multi-year bet that HBM scarcity and hyperscaler capex will justify greenfield fab construction timelines stretching into 2028–2030.

Sources