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Chips Palantir deploys NVIDIA Nemotron in air-gapped US govt AI stack Funding Q2 2026 records $1B+ startup exits: SpaceX $75B IPO, Cerebras $5.55B, Quantinuum $1.68B Funding Anthropic files confidentially for IPO at $965B valuation after $65B Series H; leapfrogs OpenAI Market SpaceX raises $25B in debt after IPO; poses diversification challenge for investors holding both equity and bonds Chips MLPerf Training v6.0: NVIDIA Blackwell sweeps, AMD within 5-6% on dense LLM training Funding Menlo Ventures raises $3B, largest in 50-year history, all-in on AI startups across stack Funding British Business Bank deploys £400m per year into UK scaleups via 10 first-time VC microfunds Funding SatVu closes £30M (€34M) thermal satellite round led by NATO Innovation Fund; HotSat constellation Breaking AWS FinOps Agent enters public preview; AI-powered cost anomaly investigation for cloud ops Chips YOFC hollow-core fiber hits 51.3 Tb/s over 128 miles unrepeatered; AI-era backbone milestone Funding Reed Semiconductor raises $100M for AI power delivery; oversubscribed round signals infrastructure demand Chips Samsung ships industry-first HBM4E samples at 16Gbps, 48GB per stack; 20%+ speed gain over HBM4 Market Micron guides $50B Q4 revenue, 86% margins; signs 16 strategic customer agreements worth ~$100B Chips d-Matrix Corsair inference accelerator enters full production; claims 10x faster decode than GPU-only with 5x less energy Market SoftBank commits €75 billion to build 5 GW of AI data center capacity across France through 2031 Funding UK government backs £400 million venture capital initiative for diverse fund managers Chips NVIDIA Blackwell platform arrives; B200/B300 GPUs ship with 4x H100 inference speed, 25x lower cost/energy Breaking HP deploys OpenAI Frontier across enterprise operations; joins six inaugural platform adopters Market 79% of global AI data center capacity faces elevated climate hazard risk; operators shift to rural, extreme-weather zones Funding Baidu's Kunlunxin targets $50B Hong Kong IPO, ties chip purchases to allocations Chips Palantir deploys NVIDIA Nemotron in air-gapped US govt AI stack Funding Q2 2026 records $1B+ startup exits: SpaceX $75B IPO, Cerebras $5.55B, Quantinuum $1.68B Funding Anthropic files confidentially for IPO at $965B valuation after $65B Series H; leapfrogs OpenAI Market SpaceX raises $25B in debt after IPO; poses diversification challenge for investors holding both equity and bonds Chips MLPerf Training v6.0: NVIDIA Blackwell sweeps, AMD within 5-6% on dense LLM training Funding Menlo Ventures raises $3B, largest in 50-year history, all-in on AI startups across stack Funding British Business Bank deploys £400m per year into UK scaleups via 10 first-time VC microfunds Funding SatVu closes £30M (€34M) thermal satellite round led by NATO Innovation Fund; HotSat constellation Breaking AWS FinOps Agent enters public preview; AI-powered cost anomaly investigation for cloud ops Chips YOFC hollow-core fiber hits 51.3 Tb/s over 128 miles unrepeatered; AI-era backbone milestone Funding Reed Semiconductor raises $100M for AI power delivery; oversubscribed round signals infrastructure demand Chips Samsung ships industry-first HBM4E samples at 16Gbps, 48GB per stack; 20%+ speed gain over HBM4 Market Micron guides $50B Q4 revenue, 86% margins; signs 16 strategic customer agreements worth ~$100B Chips d-Matrix Corsair inference accelerator enters full production; claims 10x faster decode than GPU-only with 5x less energy Market SoftBank commits €75 billion to build 5 GW of AI data center capacity across France through 2031 Funding UK government backs £400 million venture capital initiative for diverse fund managers Chips NVIDIA Blackwell platform arrives; B200/B300 GPUs ship with 4x H100 inference speed, 25x lower cost/energy Breaking HP deploys OpenAI Frontier across enterprise operations; joins six inaugural platform adopters Market 79% of global AI data center capacity faces elevated climate hazard risk; operators shift to rural, extreme-weather zones Funding Baidu's Kunlunxin targets $50B Hong Kong IPO, ties chip purchases to allocations
Funding

SatVu closes £30M (€34M) thermal satellite round led by NATO Innovation Fund; HotSat constellation

SatVu, a London-based thermal intelligence company, has closed a £30 million funding round (approximately €34 million) led by the NATO Innovation Fund, bringing total equity funding to £60 million (€68 million). The round also included the British Business Bank, Space Frontiers Fund II, and Presto Tech Horizons, alongside existing investors Molten Ventures, Adara Ventures, Ridgeline Ventures, Lockheed Martin, and Seraphim Space Fund.

SatVu operates high-resolution thermal imaging satellites that detect heat signatures day and night at 3.5-meter resolution—roughly 28 times sharper than commercial alternatives like Landsat (which operates at ~100m resolution). Unlike optical satellites, thermal imaging sees through smoke and can detect activity inside buildings and infrastructure. The company is transitioning from single-satellite demonstration (HotSat-1, launched June 2023 but ended in December 2023) to a multi-satellite constellation.

HotSat-2 and HotSat-3 are scheduled for orbit in 2026, with HotSat-4, HotSat-5, and long-lead elements of HotSat-6 already under contract. A constellation increases revisit frequency to 10–20 times per day, enabling persistent monitoring of activity and operational readiness. As of January 2026, SatVu had secured £6 million in pre-orders ahead of launches.

Beyond defence and government applications, SatVu's thermal data applies to industrial and climate monitoring: blast furnaces, cement plants, data centres, oil and gas flaring, and solar farm output. For infrastructure teams tracking data centre capacity and thermal load, SatVu provides an independent, space-based measurement layer that correlates heat signature with actual operational state—a signal particularly relevant as AI compute clusters scale and facility thermal footprints grow unpredictable.

Sources