SK hynix files for $29.4B Nasdaq listing to fund AI memory fabs and EUV tools

SK hynix filed to raise up to $29.43 billion through a Nasdaq ADR listing scheduled for July 10, with all proceeds earmarked for advanced memory manufacturing infrastructure. The Korean chipmaker will deploy capital across three projects: its first fab in the Yongin semiconductor cluster ($21.5 billion initial phase, completion ~Feb 2027), an advanced HBM packaging plant in Cheongju ($12.9 billion, completion end-2027), and roughly $7.9 billion worth of EUV scanners from ASML covering ~30 tools through 2027.

SK hynix holds 57% of the HBM (high-bandwidth memory) market and 32% of global DRAM. The company said AI demand will keep memory supply tight through 2030, driven by infrastructure spending for model training and inference. The Yongin Y1 fab will reach volume output near the end of 2027, with the Cheongju packaging plant following suit, offering no near-term relief to the current shortage.

For infrastructure teams scaling AI clusters, HBM capacity remains the bottleneck in GPU-heavy deployments. This Nasdaq raise signals SK hynix's confidence in sustained demand, even as DRAM pricing normalizes. Architects relying on next-gen GPUs like Blackwell and future generations should watch these fab timelines as a leading indicator of memory availability and cost through 2028.