LIVE · TUE, MAY 26, 2026 --:--:-- ET

Issue Nº 35 COST TOTAL $11574.90 ARTICLES TODAY 12 TOKENS TOTAL 6.77B

Running the wire

Chips VSORA unveils Jotunn8 AI inference processor at TSMC Europe symposium Chips SK Hynix unveils iHBM thermal architecture reducing HBM resistance by 30% Market Uber pumps brakes on AI spending; executives find no link yet between token inflation and shipped products Market IPO market rebounds but liquidity and exit options remain constrained for founders Funding Moneybox eyes AI-powered financial advice—if UK regulators green-light it Funding Seed deals surge while Series A odds collapse; startup funding landscape tilts toward mega-rounds Market TSMC employees threaten strikes over 15% bonus cut despite record AI-driven profits Chips LightSpeed Photonics targets AI data centers with 400-Gbps optical interconnects Breaking Google expands SynthID AI watermarking, previews content detection API Funding General Catalyst backs YC alum Lucis in $20M Series A for preventive health Chips Actions Technology traces audio chip evolution from obscurity to ubiquity Market Taiwan Stock Market Overtakes India as World's Fifth-Largest, Powered by TSMC Rise Market ASX ramps up capex spending to accelerate technology infrastructure upgrade Breaking Microsoft open-sources MDASH for large-scale AI vulnerability research Breaking OpenAI partners with Grupo Folha and Grupo UOL on strategic content partnership; Brazilian media expansion Chips Imec builds first High-NA EUV quantum dot qubit using next-gen fab process Chips Chinese GPU maker sells out 30,000 units of LX 7G100 within 48 hours Research Gemma 4 Multi-Token Prediction Delivers up to 3x Faster Token Generation Funding Most Active Legaltech Investors in Europe Identified in New Sifted Analysis Policy European Sovereignty Push Faces Corporate Welfare Concerns in AI Funding Chips VSORA unveils Jotunn8 AI inference processor at TSMC Europe symposium Chips SK Hynix unveils iHBM thermal architecture reducing HBM resistance by 30% Market Uber pumps brakes on AI spending; executives find no link yet between token inflation and shipped products Market IPO market rebounds but liquidity and exit options remain constrained for founders Funding Moneybox eyes AI-powered financial advice—if UK regulators green-light it Funding Seed deals surge while Series A odds collapse; startup funding landscape tilts toward mega-rounds Market TSMC employees threaten strikes over 15% bonus cut despite record AI-driven profits Chips LightSpeed Photonics targets AI data centers with 400-Gbps optical interconnects Breaking Google expands SynthID AI watermarking, previews content detection API Funding General Catalyst backs YC alum Lucis in $20M Series A for preventive health Chips Actions Technology traces audio chip evolution from obscurity to ubiquity Market Taiwan Stock Market Overtakes India as World's Fifth-Largest, Powered by TSMC Rise Market ASX ramps up capex spending to accelerate technology infrastructure upgrade Breaking Microsoft open-sources MDASH for large-scale AI vulnerability research Breaking OpenAI partners with Grupo Folha and Grupo UOL on strategic content partnership; Brazilian media expansion Chips Imec builds first High-NA EUV quantum dot qubit using next-gen fab process Chips Chinese GPU maker sells out 30,000 units of LX 7G100 within 48 hours Research Gemma 4 Multi-Token Prediction Delivers up to 3x Faster Token Generation Funding Most Active Legaltech Investors in Europe Identified in New Sifted Analysis Policy European Sovereignty Push Faces Corporate Welfare Concerns in AI Funding

Chips Tuesday, May 26, 2026 at 12:01 PM

SK Hynix unveils iHBM thermal architecture reducing HBM resistance by 30%

SK Hynix announced iHBM, a thermal cooling architecture integrated into the HBM interface that cuts thermal resistance by 30% at the source. The innovation targets next-gen HBM5 accelerators and dense AI data centers, addressing a critical bottleneck in high-bandwidth memory for AI workloads.

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