Trump announces Apple-Intel chip design and manufacturing partnership in US
President Trump announced on June 18, 2026 that Apple has agreed to design and manufacture chips with Intel in the United States. After more than a year of negotiations, the preliminary agreement represents a significant shift: Apple is reducing its dependence on TSMC (Taiwan Semiconductor Manufacturing Company) as its sole supplier, while Intel secures a major customer for its foundry business. Intel shares surged approximately 10-14% on the news, reflecting investor confidence in the partnership.
The timing reflects pressure on Apple's supply chain. During its latest earnings call, CEO Tim Cook disclosed that iPhone 17 models faced production constraints due to insufficient A19 and A19 Pro chip availability from TSMC. TSMC itself is stretched: HPC (high-performance computing / AI accelerators) accounted for 61% of TSMC's Q1 2026 revenue versus only 26% for smartphones, with HPC growing 20% QoQ while smartphone revenue fell 11%. Apple, historically the dominant launch customer for TSMC's newest nodes, is now competing with Nvidia and AMD for capacity.
Intel's role remains partially undefined. Neither company has disclosed which products Intel would manufacture—whether consumer devices like iPhones, Macs, or both, and at what process nodes (Intel's 14A/1.4nm expected 2028, or earlier 18A/1.8nm). The scope could range from pilot production and chiplet-focused work to full-scale manufacturing. That ambiguity matters because the technical and commercial scope will determine whether this is a modest diversification or a structural reshaping of advanced chip manufacturing.
The U.S. government played an active role. Commerce Secretary Howard Lutnick met repeatedly with Apple, NVIDIA, and SpaceX executives over the past year to encourage Intel partnerships. The administration holds a ~10% stake in Intel (valued at >$50 billion after recent gains) and has been explicitly working to 'drum up business' for the chipmaker. This marks a shift toward active industrial policy—not just subsidies but orchestrated customer-supplier relationships.
For architects: this partnership signals growing concern about concentrated chip supply risk in Taiwan amid geopolitical tensions and AI-driven demand spikes. However, new U.S. fab capacity takes years to scale. Intel's advanced nodes (14A production 2028+) cannot help Apple immediately; near-term relief would depend on existing capacity or older process nodes. Meanwhile, TSMC remains constrained, keeping memory, HBM, and leading-edge node access competitive and expensive through 2027–2028.
Sources
- Primary source
- eetimes.com
“Neither company has confirmed which Apple chips Intel might manufacture, whether the work would involve leading-edge process technologies such as Intel 18A or 14A, or whether the arrangement would involve full-scale production, pilot manufacturing, packaging, or more limited chiplet-related work.”
- supplychaindigital.com
“TSMC experiences frequent bottlenecks from orders by gen AI chipmakers including NVIDIA and AMD. Apple's Chief Executive Officer, Tim Cook, iPhone sales were limited by supply issues during a recent earnings call.”
- macrumors.com
“After more than a year of discussion, Apple and Intel established a preliminary agreement that will see Intel manufacturing processors for Apple devices. Intel has been seeking customers for its 14A 1.4nm node.”
- supplychaindigital.com
“The US Government facilitated discussions between Intel and Apple to support domestic semiconductor manufacturing. United States Secretary of Commerce, Howard Lutnick, met repeatedly over the past year with senior Apple officials and also held discussions with SpaceX Chief Executive Officer, Elon Musk, and NVIDIA Chief Executive Officer, Jensen Huang, to encourage partnerships with Intel.”