Broadcom is in talks with lenders to raise more than $60 billion in debt to finance AI chip and compute infrastructure procurement for Anthropic and other companies. The deal structure includes a senior-secured tranche of $60–70 billion, a junior debt portion of roughly $30 billion, and Broadcom guarantees on part of the senior debt. Blackstone and Apollo Global Management are participating in negotiations, following their June partnership that established a $35 billion AI infrastructure financing vehicle with Broadcom. The total financing package could reach as much as $100 billion.
The capital will flow through a special-purpose vehicle to Anthropic and other AI companies seeking to build out compute capacity without bearing full upfront hardware costs. This follows Broadcom's prior AI XPV partnership with Blackstone and Apollo, aimed at funding 20+ gigawatts of global compute. Broadcom benefits by securing massive semiconductor and data-center equipment orders; customers like Anthropic avoid balance-sheet strain while locking in chip allocation and supply.
For infrastructure architects, the financing model is becoming the industry standard: as compute-capacity constraints bite, hyperscalers and AI labs are outsourcing capex to debt structures underwritten by finance giants and backed by chip suppliers. Broadcom's dominance in custom silicon and networking for data centers means these deals effectively subsidize customer demand in Broadcom's favor, shifting market dynamics away from spot GPU pricing toward long-term contracted supply chains built on vendor financing.