Micron smashes Q3 earnings with $41.5B revenue, guides Q4 to $50B as HBM supply stays fully allocated through 2026
Micron Technology reported fiscal third-quarter earnings on June 24, 2026, posting revenue of $41.46 billion—a 4.5x increase year-over-year and 16% above the $35.69 billion consensus estimate. The company's adjusted earnings per share of $25.11 beat the $20.49 estimate by over 22%. Most significantly, Micron guided fiscal Q4 (ending August 2026) to revenue of approximately $50 billion at the midpoint, versus the prior consensus of $43.24 billion—a nearly $7 billion upside surprise. Adjusted gross margin reached 84.9%, approximately 300 basis points ahead of the 81.9% forecast, signaling pricing power is intensifying alongside volume.
The company attributed the trajectory to hyperscaler demand for high-bandwidth memory (HBM), the specialized memory that sits on Nvidia and AMD AI accelerators. Micron has allocated 100% of its 2026 HBM production to customers through long-term supply agreements. The company signed 16 new long-term contracts spanning data centers, automakers, and other customers, securing $22 billion in financial commitments spanning 3–5 years. Gross margin for Q4 is expected to reach approximately 86%, a fresh record. Management signaled HBM4 ramping roughly twice as fast as prior generations, beginning shipments in March 2026.
The earnings underscore a structural reallocation of wafer capacity: HBM, which represented less than 5% of DRAM revenue in 2022, now accounts for over 30% in 2026. HBM requires 3x the wafer capacity per gigabyte compared to consumer DRAM, meaning every wafer to hyperscalers is a wafer diverted from notebooks, smartphones, and PCs. Micron increased capex guidance by $5 billion to over $25 billion for full year 2026.
For architects and procurement teams, the implication is clear: AI infrastructure is now the highest-margin, supply-constrained segment of the memory market, and will absorb 23% of global DRAM wafer output through at least 2027. New fab capacity from Micron and SK Hynix will not reach volume until 2027 at earliest, and IDC projects no meaningful consumer memory relief until late 2027–2028. HBM2026 allocations are fully booked; HBM pricing and availability will be a structural constraint on AI capex planning through 2027.