TSMC, Intel, Samsung outline foundry roadmaps to 1.4nm and beyond

The three leading foundries released updated process roadmaps detailing their paths to 1.4nm nodes and beyond, providing visibility into advanced logic scaling over the next several years. TSMC, Intel, and Samsung are each taking different architectural and material strategies to extend Moore's Law as traditional planar scaling approaches limits.

For AI chip architects and systems designers, these roadmaps confirm the availability of next-generation process nodes through the late 2020s. The competitive roadmaps also validate continued progress in node density, critical for meeting compute density demands of large-scale foundation models.