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Running the wire
Policy White House Executive Order 14412 mandates post-quantum cryptography by 2030 for federal systems Chips Rapidus targets 2027 2nm mass production with single-wafer processing; Japan bets national semiconductor revival on one Hokkaido fab Funding EdVisorly closes $13.3M Series A for college transfer AI automation Market Together AI launches Provisioned Throughput: reserved capacity for open models at 90% below Claude Opus list Chips NVIDIA Nemotron 3 Ultra matches closed-model performance at 10x lower cost via LangChain harness tuning Chips Budget smartphone sales collapse 22% as memory costs hit 64% of BOM amid HBM supply crunch Chips DeepSeek developing in-house inference chip to cut Nvidia, Huawei reliance Chips SiPearl Rhea CPU enters bring-up; Europe's first HPC processor on track for end-2026 Market Waymo Begins Driverless Operations in San Diego, Las Vegas, Tampa, Denver Market Oregon utility raises data center rates 29.7% under POWER Act; residential bills cut 1.3% Funding Gradium voice AI startup extends seed to $100M+ with $30M NVIDIA-backed tranche Funding SambaNova raises $1B at $11B valuation; JPMorganChase deploys SN50 for on-prem AI inference Funding Blue Origin closes first outside funding round at $130B valuation; raises $10B led by Coatue Breaking OpenAI releases GPT-5.6 Sol, Terra, Luna publicly after ending government preview limits Market Anthropic revenue hits $30B ARR, overtakes OpenAI at $25B; enterprise focus drives efficiency gap Market SK Hynix launches $28B Nasdaq IPO; HBM supplier pricing Friday as second-largest offering ever Breaking Meta launches Muse Image, native AI image model to reduce third-party dependence Funding SK Hynix launches $28B Nasdaq IPO; second-largest after SpaceX, proceeds to fund South Korea fab expansion Chips South Korea's $880B fab megacluster faces critical power shortage: needs 15–16 GW, has only 1.9 GW local supply Market Samsung chip profit surges but stock tumbles 8% as AI demand concerns override earnings beat Policy White House Executive Order 14412 mandates post-quantum cryptography by 2030 for federal systems Chips Rapidus targets 2027 2nm mass production with single-wafer processing; Japan bets national semiconductor revival on one Hokkaido fab Funding EdVisorly closes $13.3M Series A for college transfer AI automation Market Together AI launches Provisioned Throughput: reserved capacity for open models at 90% below Claude Opus list Chips NVIDIA Nemotron 3 Ultra matches closed-model performance at 10x lower cost via LangChain harness tuning Chips Budget smartphone sales collapse 22% as memory costs hit 64% of BOM amid HBM supply crunch Chips DeepSeek developing in-house inference chip to cut Nvidia, Huawei reliance Chips SiPearl Rhea CPU enters bring-up; Europe's first HPC processor on track for end-2026 Market Waymo Begins Driverless Operations in San Diego, Las Vegas, Tampa, Denver Market Oregon utility raises data center rates 29.7% under POWER Act; residential bills cut 1.3% Funding Gradium voice AI startup extends seed to $100M+ with $30M NVIDIA-backed tranche Funding SambaNova raises $1B at $11B valuation; JPMorganChase deploys SN50 for on-prem AI inference Funding Blue Origin closes first outside funding round at $130B valuation; raises $10B led by Coatue Breaking OpenAI releases GPT-5.6 Sol, Terra, Luna publicly after ending government preview limits Market Anthropic revenue hits $30B ARR, overtakes OpenAI at $25B; enterprise focus drives efficiency gap Market SK Hynix launches $28B Nasdaq IPO; HBM supplier pricing Friday as second-largest offering ever Breaking Meta launches Muse Image, native AI image model to reduce third-party dependence Funding SK Hynix launches $28B Nasdaq IPO; second-largest after SpaceX, proceeds to fund South Korea fab expansion Chips South Korea's $880B fab megacluster faces critical power shortage: needs 15–16 GW, has only 1.9 GW local supply Market Samsung chip profit surges but stock tumbles 8% as AI demand concerns override earnings beat
Chips

Budget smartphone sales collapse 22% as memory costs hit 64% of BOM amid HBM supply crunch

Global budget smartphone shipments (sub-$400 devices) will plummet over 22% this year, dragging the entire smartphone market down 12% year-over-year, according to Omdia research. The culprit: skyrocketing DRAM and NAND flash memory contract prices that have turned razor-thin phone margins into an impossible equation. In sub-$100 ultra-budget phones, memory now comprises a staggering 64% of the total bill of materials (BOM), up from roughly 30% in Q3 2025—manufacturers have no money left for processors, screens, batteries, or cameras.

Memory makers SK hynix, Samsung, and Micron have aggressively redirected manufacturing capacity away from commodity smartphone memory toward high-bandwidth memory (HBM) to capture high-margin AI data-center demand. Handset makers like Xiaomi, OPPO, Vivo, and Transsion have zero structural wiggle room left to absorb costs; raising retail prices from $150 to $220 on entry-level models evaporates demand among price-sensitive buyers. Facing unviable economics and weak demand, vendors are quietly retreating from the bottom of the market to focus on higher-margin brackets.

Above $400, smartphones will grow 5.7% this year, but mid-range makers are forced to trade memory costs for other hardware cuts: stepping down from LTPO OLED to LTPS panels, reusing previous-generation SoCs, and dropping redundant camera lenses. Premium phones face direct price hikes. Relief from South Korea's $870 billion 10-year investment framework to double national memory output won't arrive in time to save this year's cycle.

Source: tomshardware.com →