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Running the wire
Funding Anthropic in talks with Samsung for custom AI chip on 2nm foundry process Breaking OpenAI launches GPT-Live voice models with full-duplex streaming and live delegation Breaking JetBrains develops governance layer for Claude Code, Codex, Gemini CLI across teams Policy White House Executive Order 14412 mandates post-quantum cryptography by 2030 for federal systems Chips Rapidus targets 2027 2nm mass production with single-wafer processing; Japan bets national semiconductor revival on one Hokkaido fab Funding EdVisorly closes $13.3M Series A for college transfer AI automation Market Together AI launches Provisioned Throughput: reserved capacity for open models at 90% below Claude Opus list Chips NVIDIA Nemotron 3 Ultra matches closed-model performance at 10x lower cost via LangChain harness tuning Chips Budget smartphone sales collapse 22% as memory costs hit 64% of BOM amid HBM supply crunch Chips DeepSeek developing in-house inference chip to cut Nvidia, Huawei reliance Chips SiPearl Rhea CPU enters bring-up; Europe's first HPC processor on track for end-2026 Market Waymo Begins Driverless Operations in San Diego, Las Vegas, Tampa, Denver Market Oregon utility raises data center rates 29.7% under POWER Act; residential bills cut 1.3% Funding Gradium voice AI startup extends seed to $100M+ with $30M NVIDIA-backed tranche Funding SambaNova raises $1B at $11B valuation; JPMorganChase deploys SN50 for on-prem AI inference Funding Blue Origin closes first outside funding round at $130B valuation; raises $10B led by Coatue Breaking OpenAI releases GPT-5.6 Sol, Terra, Luna publicly after ending government preview limits Market Anthropic revenue hits $30B ARR, overtakes OpenAI at $25B; enterprise focus drives efficiency gap Market SK Hynix launches $28B Nasdaq IPO; HBM supplier pricing Friday as second-largest offering ever Breaking Meta launches Muse Image, native AI image model to reduce third-party dependence Funding Anthropic in talks with Samsung for custom AI chip on 2nm foundry process Breaking OpenAI launches GPT-Live voice models with full-duplex streaming and live delegation Breaking JetBrains develops governance layer for Claude Code, Codex, Gemini CLI across teams Policy White House Executive Order 14412 mandates post-quantum cryptography by 2030 for federal systems Chips Rapidus targets 2027 2nm mass production with single-wafer processing; Japan bets national semiconductor revival on one Hokkaido fab Funding EdVisorly closes $13.3M Series A for college transfer AI automation Market Together AI launches Provisioned Throughput: reserved capacity for open models at 90% below Claude Opus list Chips NVIDIA Nemotron 3 Ultra matches closed-model performance at 10x lower cost via LangChain harness tuning Chips Budget smartphone sales collapse 22% as memory costs hit 64% of BOM amid HBM supply crunch Chips DeepSeek developing in-house inference chip to cut Nvidia, Huawei reliance Chips SiPearl Rhea CPU enters bring-up; Europe's first HPC processor on track for end-2026 Market Waymo Begins Driverless Operations in San Diego, Las Vegas, Tampa, Denver Market Oregon utility raises data center rates 29.7% under POWER Act; residential bills cut 1.3% Funding Gradium voice AI startup extends seed to $100M+ with $30M NVIDIA-backed tranche Funding SambaNova raises $1B at $11B valuation; JPMorganChase deploys SN50 for on-prem AI inference Funding Blue Origin closes first outside funding round at $130B valuation; raises $10B led by Coatue Breaking OpenAI releases GPT-5.6 Sol, Terra, Luna publicly after ending government preview limits Market Anthropic revenue hits $30B ARR, overtakes OpenAI at $25B; enterprise focus drives efficiency gap Market SK Hynix launches $28B Nasdaq IPO; HBM supplier pricing Friday as second-largest offering ever Breaking Meta launches Muse Image, native AI image model to reduce third-party dependence
Chips

Rapidus targets 2027 2nm mass production with single-wafer processing; Japan bets national semiconductor revival on one Hokkaido fab

Rapidus, Japan's state-backed chipmaker, is pursuing an audacious path: mass production of 2nm logic at a single fab in Chitose, Hokkaido, with a 2027 target and no volume customer commitments yet. The company has successfully produced a 2nm gate-all-around prototype matching expected electrical characteristics, begun pilot production at its IIM-1 facility using Japan's first mass-production-grade EUV scanner, and generated over 60 customer conversations—but zero volume agreements signed.

The company's differentiation hinges on single-wafer front-end processing with AI-driven yield learning, rather than the batch processing used by TSMC and Samsung. This approach prioritizes precision and process flexibility over speed, enabling Rapidus to market itself as the fast-turnaround alternative for companies iterating chip designs. The Japanese government secured ¥267.6 billion ($1.7 billion) in February and an additional ¥631.5 billion in June, making the state Rapidus's largest shareholder with a 'golden share' veto over key decisions.

Japan's commitment is existential: TSMC and Samsung already achieved volume production of 2nm in Q4 2025, giving Rapidus a roughly two-year lag. The company expects 6,000 wafer starts monthly at launch in H2 2027, scaling to 25,000 by 2028. Per-wafer costs hinge on that ramp; without it, the economics collapse. CEO Atsuyoshi Koike said the company expects profitability within years, not decades.

The greatest risk is customer acquisition. Rapidus cannot justify fab operating costs without steady wafer orders; government subsidies buy time but not forever. That's why Japan's state-backed NEDO organization is commissioning Rapidus for chiplet and 3D packaging R&D, hoping to create demand internally. For chip architects considering 2nm sourcing outside TSMC/Samsung, Rapidus is moving from science project to credible supplier, but only if it can attract anchor customers before 2027.

Sources