LIVE · TUE, JUL 07, 2026 --:--:-- ET

Issue Nº 77 COST TOTAL $14685.02 ARTICLES TODAY 6 TOKENS TOTAL 9.34B

Running the wire

Chips Intel XBM patent ditches HBM's silicon interposer; backend-transistor DRAM + UCIe for $-efficient AI memory Market Samsung Q2 2026: $58.6B operating profit shatters NVIDIA, 40-year chip-biz cumulative Chips Pasqal, Aeponyx launch Canadian PIC packaging center; targets 500k modules/year by phase 2 Market Samsung Q2 operating profit hits $58.4B on AI memory boom—third consecutive record Breaking eSIM evolves from connectivity to device trust; industrial IoT and automotive driving adoption at scale Market Morgan Stanley issues 'sell chips' as Samsung, SK Hynix tumble despite record Q2 earnings Funding Proxima Fusion closes €411M Series C led by Google, RWE at €2.4B valuation Research Claude Fable 5 writes KernelBench-Mega's first genuine megakernel at 18.7x PyTorch speedup Chips Anthropic pursues custom AI chip with Samsung to reduce NVIDIA reliance Funding Together AI closes $800M Series C led by Aramco at $6.5B valuation on $1.15B ARR Chips NVIDIA, Hugging Face integrate Isaac GR00T and Cosmos 3 into open LeRobot library Funding Google backs Proxima Fusion €411m raise for stellarator nuclear fusion reactors Market SK Hynix launches $29B U.S. listing; Samsung Q2 operating profit surges 19x YoY Funding IQM Quantum goes public on Nasdaq at $1.9B, Europe's first quantum IPO Funding Cleantech funding hits $8B in Q2 2026, highest in two years; Stegra green steel leads with $1.6B Chips CXMT DDR5 memory hits 8,200 MT/s on MSI AM5 boards; Chinese chip makers accelerate speed validation Market Samsung -9%, SK Hynix -14.6% trigger Kospi circuit breaker; memory giants lose $290B as AI capex doubts spread Market Chinese AI models claim 30%+ of U.S. token traffic; Z.ai's GLM-5.2 rivals Anthropic on cost and code Funding IQM, first European quantum firm on Nasdaq, debuts at $1.9B valuation amid dealer skepticism Funding Hive raises $15M for autonomous industrial 'silicon brain' claiming 80% cost reduction Chips Intel XBM patent ditches HBM's silicon interposer; backend-transistor DRAM + UCIe for $-efficient AI memory Market Samsung Q2 2026: $58.6B operating profit shatters NVIDIA, 40-year chip-biz cumulative Chips Pasqal, Aeponyx launch Canadian PIC packaging center; targets 500k modules/year by phase 2 Market Samsung Q2 operating profit hits $58.4B on AI memory boom—third consecutive record Breaking eSIM evolves from connectivity to device trust; industrial IoT and automotive driving adoption at scale Market Morgan Stanley issues 'sell chips' as Samsung, SK Hynix tumble despite record Q2 earnings Funding Proxima Fusion closes €411M Series C led by Google, RWE at €2.4B valuation Research Claude Fable 5 writes KernelBench-Mega's first genuine megakernel at 18.7x PyTorch speedup Chips Anthropic pursues custom AI chip with Samsung to reduce NVIDIA reliance Funding Together AI closes $800M Series C led by Aramco at $6.5B valuation on $1.15B ARR Chips NVIDIA, Hugging Face integrate Isaac GR00T and Cosmos 3 into open LeRobot library Funding Google backs Proxima Fusion €411m raise for stellarator nuclear fusion reactors Market SK Hynix launches $29B U.S. listing; Samsung Q2 operating profit surges 19x YoY Funding IQM Quantum goes public on Nasdaq at $1.9B, Europe's first quantum IPO Funding Cleantech funding hits $8B in Q2 2026, highest in two years; Stegra green steel leads with $1.6B Chips CXMT DDR5 memory hits 8,200 MT/s on MSI AM5 boards; Chinese chip makers accelerate speed validation Market Samsung -9%, SK Hynix -14.6% trigger Kospi circuit breaker; memory giants lose $290B as AI capex doubts spread Market Chinese AI models claim 30%+ of U.S. token traffic; Z.ai's GLM-5.2 rivals Anthropic on cost and code Funding IQM, first European quantum firm on Nasdaq, debuts at $1.9B valuation amid dealer skepticism Funding Hive raises $15M for autonomous industrial 'silicon brain' claiming 80% cost reduction

Breaking Tuesday, July 7, 2026 at 08:34 AM

eSIM evolves from connectivity to device trust; industrial IoT and automotive driving adoption at scale

Embedded SIM (eSIM) is transitioning beyond consumer connectivity into industrial infrastructure authentication and lifecycle management. G+D Mobile Security CEO Philipp Schulte told EE Times that the eSIM is becoming the "root of trust" for connected devices—a security anchor that authenticates devices, protects communications, and enables remote provisioning across industrial IoT, automotive, logistics, and smart city deployments. The automotive sector leads adoption, with most modern vehicles now running two eSIMs: one for diagnostics/OEM services and another for independent infotainment subscriptions.

Remote SIM provisioning, standardized by GSMA's SGP.32 specification for IoT, is the enabler. Manufacturers can now deploy identical hardware globally and push region-specific operator profiles remotely after deployment, reducing SKU complexity. Kigen CEO Vincent Korstanje highlighted automotive as the canonical case: vehicles built in one country can ship worldwide, receiving appropriate connectivity profiles on arrival. The same framework works for fleet logistics, utility meters, and railway infrastructure—devices with vastly different traffic patterns (vehicles: multi-gigabyte daily; meters: sparse fixed-interval) can all use the same provisioning backbone.

For production teams, eSIM shifts the SIM from a pre-manufacturing constraint to a post-deployment capability. This is significant for international rollouts: no more regional variants, no field replacement of SIM hardware, and lifecycle security updates across connected fleets. Industries managing thousands to millions of edge devices—from connected cars to smart meters to infrastructure sensors—now have a scalable, secure alternative to proprietary connectivity management, reducing vendor lock-in.

Sources