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Market SK Hynix Raises Record $26.5B in Nasdaq IPO; CEO Warns 2027 Will Be Worst-Ever Memory Shortage Funding DeepSeek Eyes 2027 IPO, Targets $71B Valuation in Fresh Fundraise Just 6 Weeks After $7B Round Funding Corporate Venture Capital Splits in Two as Mega-Funds Consolidate, Strategic Arms Close Chips Intel Commits €5B to Leixlip, Ireland After Ditching Magdeburg Megafab Funding Fintech Funding Surges 23% in H1 2026 to $28.6B Despite 26% Drop in Deal Count Funding Chai Discovery closes $400M Series C at $3.8B; AI drug design moves to pharma production Chips CXMT projected to match Micron's DRAM capacity by end-2026 at 350K wafers/month Chips Intel 18A yields hit 85%, secures design wins from AMD, NVIDIA, OpenAI as TSMC capacity crunch widens foundry market Breaking Meta cuts ads serving p99 latency 28% with custom kernel scheduler built on sched_ext; 3.3MW power savings Market SK Hynix raises $26.5B in record Nasdaq IPO; CEO warns HBM shortage will extend beyond 2030 Funding Chai Discovery raises $400M Series C at $3.8B valuation; AI drug discovery reaches pharma scale Funding Motorola acquires D-Fend for $1.5B to build end-to-end counter-drone stack amid Safer Skies Act expansion Market SK Hynix shares surge 13% on softer inflation, renewed AI memory demand strength Chips TSMC breaks ground on Phase II Chiayi advanced packaging plants; CoWoS capacity to grow 80%+ through 2027 Market ASML raises full-year guidance again on AI chip demand; expects €43–45B revenue, gross margin to 54–56% Funding H1 2026 global VC hits $412.7B, 86% to AI; investors bet on inference chip wars Research Researcher exposes systemic LLM jailbreaks across OpenAI, Google, Meta; obtains nuke/bioweapon details with simple prompting Market SK Hynix shares surge 11% as Asia chip rally bounces back from sell-off Funding NinjaOne raises $400M Series C extension at $12.3B valuation; achieves profitability on 70% YoY growth Market OpenAI Codex Hits 8M Users in 5 Days Post–GPT-5.6; Forced to Reset Usage Caps Market SK Hynix Raises Record $26.5B in Nasdaq IPO; CEO Warns 2027 Will Be Worst-Ever Memory Shortage Funding DeepSeek Eyes 2027 IPO, Targets $71B Valuation in Fresh Fundraise Just 6 Weeks After $7B Round Funding Corporate Venture Capital Splits in Two as Mega-Funds Consolidate, Strategic Arms Close Chips Intel Commits €5B to Leixlip, Ireland After Ditching Magdeburg Megafab Funding Fintech Funding Surges 23% in H1 2026 to $28.6B Despite 26% Drop in Deal Count Funding Chai Discovery closes $400M Series C at $3.8B; AI drug design moves to pharma production Chips CXMT projected to match Micron's DRAM capacity by end-2026 at 350K wafers/month Chips Intel 18A yields hit 85%, secures design wins from AMD, NVIDIA, OpenAI as TSMC capacity crunch widens foundry market Breaking Meta cuts ads serving p99 latency 28% with custom kernel scheduler built on sched_ext; 3.3MW power savings Market SK Hynix raises $26.5B in record Nasdaq IPO; CEO warns HBM shortage will extend beyond 2030 Funding Chai Discovery raises $400M Series C at $3.8B valuation; AI drug discovery reaches pharma scale Funding Motorola acquires D-Fend for $1.5B to build end-to-end counter-drone stack amid Safer Skies Act expansion Market SK Hynix shares surge 13% on softer inflation, renewed AI memory demand strength Chips TSMC breaks ground on Phase II Chiayi advanced packaging plants; CoWoS capacity to grow 80%+ through 2027 Market ASML raises full-year guidance again on AI chip demand; expects €43–45B revenue, gross margin to 54–56% Funding H1 2026 global VC hits $412.7B, 86% to AI; investors bet on inference chip wars Research Researcher exposes systemic LLM jailbreaks across OpenAI, Google, Meta; obtains nuke/bioweapon details with simple prompting Market SK Hynix shares surge 11% as Asia chip rally bounces back from sell-off Funding NinjaOne raises $400M Series C extension at $12.3B valuation; achieves profitability on 70% YoY growth Market OpenAI Codex Hits 8M Users in 5 Days Post–GPT-5.6; Forced to Reset Usage Caps
Chips

CXMT projected to match Micron's DRAM capacity by end-2026 at 350K wafers/month

Chinese memory maker ChangXin Memory Technologies (CXMT) is forecast to produce approximately 350,000 DRAM wafers per month by the end of 2026, nearly matching Micron's expected 375,000 wafers per month, according to Citrini Research's bottom-up capacity model. If realized, this would position CXMT as the fourth-largest global DRAM producer (by wafer capacity), reshaping competitive dynamics in the commodity memory market and signaling China's rapid ascent in semiconductor self-sufficiency.

The government is reportedly directing CXMT to share its DRAM technology with peers JHICC, Swaysure, and YMTC subsidiary XMC to ease domestic shortages. If all these facilities reach planned capacity in coming years, China's total DRAM output would reach 600,000 wafers per month by the end of the decade—significantly lower than South Korea but ahead of Japan, Taiwan, and the US combined. CXMT itself is targeting 950,000 WSPM by 2030 through new fabs in Beijing, Hefei, and Shanghai. The company is also ramping HBM3 production, starting volume production in 2026.

For operators: CXMT's capacity gain does not immediately translate to market displacement. While the company has shipped DDR5 at 8,000 MT/s with densities approaching competitors, yields, product mix, and supply-chain maturity still lag the incumbents. The real constraint is advanced lithography—US export controls block CXMT from EUV tools, forcing reliance on older DUV equipment and multi-patterning. Domestic tools (SMEE, SiCarrier) may ramp by 2027, but production maturity is not expected before the early 2030s. The key watch: global DRAM demand is forecast to exceed supply through at least 2027, meaning CXMT's incremental capacity feeds existing shortage rather than crushing prices short-term.

Sources

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