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Policy UN Global Dialogue on AI Governance opens July 6 with 193 nations; scientific panel warns no technical guarantee of AI safety Breaking Anthropic transitions Fable 5 to usage-based credits; Pro/Max/Team subscriptions lose free access from July 8 Breaking Pentagon-blacklisted Hesai expands U.S. footprint via NVIDIA autonomous platform; lidar cybersecurity concerns cited Breaking Anthropic's Claude Fable 5 restored globally after 19-day export control suspension Market Chipmakers rout as semiconductor index tumbles 6.3%; KLA, Micron, Samsung, SK Hynix lead declines Policy EU AI Act "Digital Omnibus" extends SME simplifications to mid-caps; high-risk deadline August 2 2026 Chips Kioxia and SanDisk sample 332-layer BiCS10 NAND with 29+ Gb/mm² density for data centers Funding North American startups raised record $392B in H1 2026, with Anthropic pulling $65B Market Samsung Q2 profit jumps 19-fold on AI chip surge, but shares tumble 9% on valuation fears Breaking Mistral open-weight model launching July with early access; ARR tops $400M, targeting $1B in 2026 Chips Intel XBM patent ditches HBM's silicon interposer; backend-transistor DRAM + UCIe for $-efficient AI memory Market Samsung Q2 2026: $58.6B operating profit shatters NVIDIA, 40-year chip-biz cumulative Chips Pasqal, Aeponyx launch Canadian PIC packaging center; targets 500k modules/year by phase 2 Market Samsung Q2 operating profit hits $58.4B on AI memory boom—third consecutive record Breaking eSIM evolves from connectivity to device trust; industrial IoT and automotive driving adoption at scale Market Morgan Stanley issues 'sell chips' as Samsung, SK Hynix tumble despite record Q2 earnings Funding Proxima Fusion closes €411M Series C led by Google, RWE at €2.4B valuation Research Claude Fable 5 writes KernelBench-Mega's first genuine megakernel at 18.7x PyTorch speedup Chips Anthropic pursues custom AI chip with Samsung to reduce NVIDIA reliance Funding Together AI closes $800M Series C led by Aramco at $6.5B valuation on $1.15B ARR Policy UN Global Dialogue on AI Governance opens July 6 with 193 nations; scientific panel warns no technical guarantee of AI safety Breaking Anthropic transitions Fable 5 to usage-based credits; Pro/Max/Team subscriptions lose free access from July 8 Breaking Pentagon-blacklisted Hesai expands U.S. footprint via NVIDIA autonomous platform; lidar cybersecurity concerns cited Breaking Anthropic's Claude Fable 5 restored globally after 19-day export control suspension Market Chipmakers rout as semiconductor index tumbles 6.3%; KLA, Micron, Samsung, SK Hynix lead declines Policy EU AI Act "Digital Omnibus" extends SME simplifications to mid-caps; high-risk deadline August 2 2026 Chips Kioxia and SanDisk sample 332-layer BiCS10 NAND with 29+ Gb/mm² density for data centers Funding North American startups raised record $392B in H1 2026, with Anthropic pulling $65B Market Samsung Q2 profit jumps 19-fold on AI chip surge, but shares tumble 9% on valuation fears Breaking Mistral open-weight model launching July with early access; ARR tops $400M, targeting $1B in 2026 Chips Intel XBM patent ditches HBM's silicon interposer; backend-transistor DRAM + UCIe for $-efficient AI memory Market Samsung Q2 2026: $58.6B operating profit shatters NVIDIA, 40-year chip-biz cumulative Chips Pasqal, Aeponyx launch Canadian PIC packaging center; targets 500k modules/year by phase 2 Market Samsung Q2 operating profit hits $58.4B on AI memory boom—third consecutive record Breaking eSIM evolves from connectivity to device trust; industrial IoT and automotive driving adoption at scale Market Morgan Stanley issues 'sell chips' as Samsung, SK Hynix tumble despite record Q2 earnings Funding Proxima Fusion closes €411M Series C led by Google, RWE at €2.4B valuation Research Claude Fable 5 writes KernelBench-Mega's first genuine megakernel at 18.7x PyTorch speedup Chips Anthropic pursues custom AI chip with Samsung to reduce NVIDIA reliance Funding Together AI closes $800M Series C led by Aramco at $6.5B valuation on $1.15B ARR
Chips

Kioxia and SanDisk sample 332-layer BiCS10 NAND with 29+ Gb/mm² density for data centers

Kioxia and SanDisk have begun sampling the 10th Generation BiCS 3D TLC NAND (BiCS10) with 332 active layers, delivering greater than 29 Gb/mm² areal density and 4,800 MT/s data transfer rate—designed explicitly for data-center-grade storage where density and performance trump cost. The new memory surpasses Samsung's latest V10-class NAND in raw storage density, a major milestone in the race for hyperscale storage.

BiCS10 achieves a 59% boost in bit density compared to the prior BiCS9 generation (218 layers, 22.9 Gb/mm²) while cutting read latency by ~4 microseconds (~10%) and reducing read energy consumption by 25%—from roughly 100 mJ/GB to ~75 mJ/GB. These gains stem from a redesigned read scheme: during consecutive reads, word lines are held at an intermediate voltage rather than fully discharged to ground, dramatically reducing recharge time and current draw on the tall 332-layer stacks where word-line length amplifies losses.

Manufacturing is split strategically: Kioxia's newest Fab 2 in Kitakami, Iwate, will produce BiCS10, while the mature Yokkaichi complex manufactures BiCS9 for client applications. Fab 2 houses Kioxia's most advanced tools and is suited to leading-edge NAND, while the largely depreciated Yokkaichi fabs enable lower-cost mainstream production. This strategy reserves cutting-edge capacity for the highest-density products.

For architects: BiCS10's 332-layer density and 4,800 MT/s throughput directly address hyperscaler demand for denser, faster PCIe 5.0/6.0 SSDs at scale. The performance gains (lower latency, reduced energy) are critical for read-heavy cloud workloads. Kioxia's manufacturing discipline—segregating advanced and mature nodes—signals confidence in sustained BiCS10 demand and cost reduction roadmap.

Sources